CPUs

Apple A9 (Samsung) vs Intel Core i5-3317U Full Specs

2 Cores
2 Threads
1.85GHz
2 Cores
4 Threads
1.7GHz
TDP
5W
TDP
17W
Bandwidth
25.6GB/s
LPDDR4
Bandwidth
25.6GB/s
·
iGPU
iGPU
··
499.2 GFLOPSFP16
··
268.8 GFLOPSFP32
Socket
-
Socket

A9 (Samsung)A9 (Samsung)644
x1.44
Core i5-3317UCore i5-3317U446
x1

2 Cores
2 Cores
2 Threads
4 Threads

Base Clock
1.85GHz
Base Clock
1.7GHz
Boost Clock
-
Boost Clock
2.6GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB
L1i
32KB
L1d
64KB
L1d
32KB
L2
3MB shared
L2
256KB
L3
4MB
L3
3MB

Type
LPDDR4
Type
·
Max Memory
2GB
Max Memory
32GB
ECC
No
ECC
No
Channels
1
Channels
2
Bus Width
64-bit
Bus Width
128-bit
Speed
3200MT/s
Speed
1600MT/s
Bandwidth
25.6GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
5W
TDP
17W
Max Operating Temp
-
Max Operating Temp
105°C Max

Bus Type
-
Bus Type
DMI
Bus Config
-
Bus Config
4 lanes
Bus Speed
-
Bus Speed
5GT/s
Bus Bandwidth
-
Bus Bandwidth
2.5GB/s

-
PCIe
PCIe 2.0 x16
8GB/sBandwidth

iGPU
iGPU
Shaders
192
Shaders
128
Boost Clock
650MHz
Boost Clock
1.05GHz
··
499.2 GFLOPSFP16
··
268.8 GFLOPSFP32

Manufacturer
Manufacturer
ISA
AArch64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
A9  branding
Branding
Core i5 2011 branding
Codename
Maui
-
A9 SamsungVariant
TwisterP-Core
Codename
Ivy Bridge
Ivy Bridge-H-2Die
Ivy Bridge-2C-GT2Variant
-
Market Segment
Smartphone
Market Segment
Laptop
Release Date
Sep 25, 2015
Release Date
Jun 1, 2012

Foundry
Samsung
Foundry
Intel
Fabrication Node
14LPP
Fabrication Node
22nm
Die Size
96mm²
Die Size
118mm²
Transistor Count
2.5 Billion
Transistor Count
945 Million
Transistor Density
26 MTr/mm²
Transistor Density
8 MTr/mm²

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