CPUs

Apple A9 (Samsung) vs Qualcomm Snapdragon 845 Full Specs

2 Cores
2 Threads
1.85GHz
8 Cores(4P+4E)
8 Threads(4P+4E)
2.8GHz
TDP
5W
TDP
5W
Bandwidth
25.6GB/s
LPDDR4
Bandwidth
29.9GB/s
LPDDR4X
iGPU
iGPU
··
499.2 GFLOPSFP16
··
1.45 TFLOPSFP16

A9 (Samsung)A9 (Samsung)644
x1.31
Snapdragon 845Snapdragon 845493
x1

2 Cores
2P
-
8 Cores
4P
4E
2 Threads
2P
-
8 Threads
4P
4E

Base Clock
1.85GHz
Base Clock
2.8GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
-
L1i
32KB P
32KB E
L1d
64KB P
-
L1d
32KB P
32KB E
L2
3MB P shared
L2
256KB P
128KB E
-
L3
4MB
L3
2MB
SLC Cache
-
SLC Cache
3MB

Type
LPDDR4
Type
LPDDR4X
Max Memory
2GB
Max Memory
16GB
ECC
No
ECC
No
Channels
1
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
3200MT/s
Speed
3733MT/s
Bandwidth
25.6GB/s
Bandwidth
29.9GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
29.9GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
192
Shaders
512
Boost Clock
650MHz
Boost Clock
710MHz
··
499.2 GFLOPSFP16
··
1.45 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon 685
Performance
-
Performance
3 TOPS

Modem Model
-
Modem Model
X20
Peak Down
-
Peak Down
Up to 1.2Gbps
Peak Up
-
Peak Up
Up to 150Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Kryo 385ARMv8.2-A
Family
Family
Branding
A9  branding
Branding
Snapdragon 8 Series  branding
Codename
Maui
A9 SamsungVariant
TwisterP-Core
-
Codename
-
-
Cortex-A75P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Sep 25, 2015
Release Date
Dec 6, 2017

Foundry
Samsung
Foundry
Samsung
Fabrication Node
14LPP
Fabrication Node
10LPP
Die Size
96mm²
Die Size
-
Transistor Count
2.5 Billion
Transistor Count
-
Transistor Density
26 MTr/mm²
Transistor Density
-

No images available
No images available