Apple M2 Max (12C30G) vs Intel Core i7-13700H Full Specs

Summary

12 Cores(8P+4E) 12 Threads(8P+4E) 3.69GHz	14 Cores(6P+8E) 20 Threads(12P+8E) 2.4GHz
TDP 140W	TDP 45W
Bandwidth 409.6GB/s LPDDR5	Bandwidth 102.4GB/s LPDDR5X·DDR5·LPDDR4X·DDR4
iGPU 30-Core M2 Max	iGPU Iris Xe 96EU 1500MHz
Peak·FP32·FP16 10.74 TFLOPSFP16	Peak·FP32·FP16 4.61 TFLOPSFP16
Socket -	Socket BGA 1744

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M2 Max (12C30G)2,825

x1.11

Core i7-13700H2,538

x1

Show Top Score

Core Config

12 Cores 8P 4E	14 Cores 6P 8E
12 Threads 8P 4E	20 Threads 12P 8E

Clocks

Base Clock 3.69GHz	Base Clock 2.4GHz
Boost Clock -	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P 64KB E
L1d 128KB P 64KB E	L1d 48KB P 32KB E
L2 24MB P shared 4MB E shared	L2 1.25MB P - 4MB E shared
L3 -	L3 24MB
SLC Cache 48MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X·DDR5·LPDDR4X·DDR4
Max Memory 64GB	Max Memory 96GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 512-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 6400MT/s
Bandwidth 409.6GB/s	Bandwidth 102.4GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 409.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s

Power & Thermals

TDP 140W	TDP 45W
Peak Power -	Peak Power 115W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x8 15.8GB/sBandwidth

iGPU

iGPU 30-Core M2 Max	iGPU Iris Xe 96EU 1500MHz
Shaders 3840	Shaders 768
Boost Clock 1.4GHz	Boost Clock 1.5GHz
Peak·FP32·FP16 10.74 TFLOPSFP16	Peak·FP32·FP16 4.61 TFLOPSFP16

NPU

NPU Model H14 Selene	NPU Model GNA 3.0
NPU Cores 16	NPU Cores -
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 11ARMv8.5-A	Architecture Raptor Lake
Family M Series	Family Core 13th Gen
Branding	Branding
Codename Rhodes-1C M2 MaxVariant AvalancheP-Core BlizzardE-Core	Codename Raptor Lake-H Raptor Lake-6P-8EVariant Golden CoveP-Core GracemontE-Core
Market Segment Desktop	Market Segment Laptop
Release Date Jan 17, 2023	Release Date Jan 1, 2023

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N5P	Fabrication Node Intel 7
Die Size 486mm²	Die Size 208mm²
Transistor Count 67 Billion	Transistor Count 15.2 Billion
Transistor Density 138 MTr/mm²	Transistor Density 73 MTr/mm²

Images

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Used In

Laptops MacBook Pro 14(M2 Max, Early 2023)MacBook Pro 16(M2 Max, Early 2023)	Laptops XPS 15(9530, Early 2023)XPS 17(9730, Early 2023)Inspiron 14 Plus(7430, Early 2023) Show 4 more
Desktops Mac Studio(M2 Max, Mid 2023)	Desktops -

Competitors

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IntelCore i7-13700H vs CPU IntelCore Ultra 7 255H IntelCore i7-13700H vs CPU IntelCore Ultra 7 265H IntelCore i7-13700H vs CPU IntelCore Ultra 9 285H Show 12 more