Apple M2 Max (12C30G) vs Intel Core i9-13950HX Full Specs

Summary

12 Cores(8P+4E) 12 Threads(8P+4E) 3.69GHz	24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz
TDP 140W	TDP 55W
Bandwidth 409.6GB/s LPDDR5	Bandwidth 89.6GB/s DDR5·DDR4
iGPU 30-Core M2 Max	iGPU UHD 32EU 1650MHz Gen 12
Peak·FP32·FP16 10.74 TFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16
Socket -	Socket BGA 1964

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M2 Max (12C30G)2,825

x1.05

Core i9-13950HX2,680

x1

Show Top Score

Core Config

12 Cores 8P 4E	24 Cores 8P 16E
12 Threads 8P 4E	32 Threads 16P 16E

Clocks

Base Clock 3.69GHz	Base Clock 2.2GHz
Boost Clock -	Boost Clock 5.5GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 192KB P 128KB E	L1i 32KB P 64KB E
L1d 128KB P 64KB E	L1d 48KB P 32KB E
L2 24MB P shared 4MB E shared	L2 2MB P - 16MB E shared
L3 -	L3 36MB
SLC Cache 48MB	SLC Cache -

Memory

Type LPDDR5	Type DDR5·DDR4
Max Memory 64GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 2
Bus Width 512-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 5600MT/s
Bandwidth 409.6GB/s	Bandwidth 89.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 409.6GB/s	Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s

Power & Thermals

TDP 140W	TDP 55W
Peak Power -	Peak Power 157W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 30-Core M2 Max	iGPU UHD 32EU 1650MHz Gen 12
Shaders 3840	Shaders 256
Boost Clock 1.4GHz	Boost Clock 1.65GHz
Peak·FP32·FP16 10.74 TFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16

NPU

NPU Model H14 Selene	NPU Model GNA 3.0
NPU Cores 16	NPU Cores -
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 11ARMv8.5-A	Architecture Raptor Lake
Family M Series	Family Core 13th Gen
Branding	Branding
Codename Rhodes-1C M2 MaxVariant AvalancheP-Core BlizzardE-Core	Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core
Market Segment Desktop	Market Segment Laptop
Release Date Jan 17, 2023	Release Date Jan 1, 2023

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N5P	Fabrication Node Intel 7
Die Size 486mm²	Die Size 257mm²
Transistor Count 67 Billion	Transistor Count 18.5 Billion
Transistor Density 138 MTr/mm²	Transistor Density 72 MTr/mm²

Images

No images available

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Used In

Laptops MacBook Pro 14(M2 Max, Early 2023)MacBook Pro 16(M2 Max, Early 2023)	Laptops Blade 16(Early 2023)
Desktops Mac Studio(M2 Max, Mid 2023)	Desktops -

Competitors

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