Apple M2 Max (12C30G) vs Intel Core Ultra 7 155H Full Specs
12 Cores(8P+4E) 12 Threads(8P+4E) 3.69GHz | 16 Cores(6P+8M+2E) 22 Threads(12P+8M+2E) 1.4GHz |
TDP 140W | TDP 28W |
Bandwidth 409.6GB/s LPDDR5 | Bandwidth 119.5GB/s · |
iGPU | iGPU |
·· 10.74 TFLOPSFP16 | ·· 9.22 TFLOPSFP16 |
Socket - | Socket |
M2 Max (12C30G)2,825
Core Ultra 7 155H2,40012 Cores 8P - 4E | 16 Cores 6P 8M 2E |
12 Threads 8P - 4E | 22 Threads 12P 8M 2E |
Base Clock 3.69GHz | Base Clock 1.4GHz |
Boost Clock - | Boost Clock 4.8GHz |
Overclocking Locked | Overclocking Locked |
L1i 192KB P - 128KB E | L1i 64KB P 64KB M 64KB E |
L1d 128KB P - 64KB E | L1d 48KB P 32KB M 32KB E |
L2 24MB P shared - 4MB E shared | L2 2MB P - 4MB M shared 2MB E shared |
L3 - | L3 24MB |
SLC Cache 48MB | SLC Cache - |
Type LPDDR5 | Type · |
Max Memory 64GB | Max Memory 96GB |
ECC No | ECC No |
Channels 4 | Channels 2 |
Bus Width 512-bit | Bus Width 128-bit |
Speed 6400MT/s | Speed 7466MT/s |
Bandwidth 409.6GB/s | Bandwidth 119.5GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 409.6GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 119.5GB/s |
TDP 140W | TDP 28W |
cTDP-down - | cTDP-down 20W |
cTDP-up - | cTDP-up 65W |
Peak Power - | Peak Power 115W |
Max Operating Temp 100°C Max | Max Operating Temp 110°C Max |
PCIe PCIe 4.0 x1631.5GB/sBandwidth | PCIe PCIe 5.0 x831.5GB/sBandwidth |
- | PCIe Secondary PCIe 4.0 x2039.4GB/sBandwidth |
iGPU | iGPU |
Shaders 3840 | Shaders 1024 |
Boost Clock 1.4GHz | Boost Clock 2.25GHz |
·· 10.74 TFLOPSFP16 | ·· 9.22 TFLOPSFP16 |
NPU Model H14 Selene | NPU Model AI Boost 3 |
NPU Cores 16 | NPU Cores 2 |
NPU Clock 2.1GHz | NPU Clock 1.4GHz |
Performance 15.8 TOPSFP16 | Performance 11.5 TOPSINT8 |
Manufacturer | Manufacturer |
ISA AArch64 | ISA x86-64 |
Architecture Apple Silicon 11ARMv8.5-A | Architecture |
Family | Family |
Branding  | Branding  |
Codename Rhodes-1C M2 MaxVariant AvalancheP-Core - BlizzardE-Core | Codename Meteor Lake-H Meteor Lake-P-6PVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core |
Market Segment Desktop | Market Segment Laptop |
Release Date Jan 17, 2023 | Release Date Dec 14, 2023 |
Foundry TSMC | Foundry Intel |
Other Foundries - | Other Foundries TSMCiGPU TSMCIO TSMCSoC |
Fabrication Node N5P - - - | Fabrication Node Intel 4 N5iGPU N6IO N6SoC |
Die Size 486mm² - - - | Die Size 68mm² 44mm²iGPU 28mm²IO 100mm²SoC |
Transistor Count 67 Billion | Transistor Count 10 Billion |
Transistor Density 138 MTr/mm² | Transistor Density 147 MTr/mm² |
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