Apple M2 Pro (10C16G) vs AMD Ryzen AI Max 385 Full Specs

Summary

10 Cores(6P+4E) 10 Threads(6P+4E) 3.5GHz	8 Cores 16 Threads 3.6GHz
TDP 60W	TDP 65W
Bandwidth 204.8GB/s LPDDR5	Bandwidth 256GB/s LPDDR5X
iGPU 16-Core M2 Pro	iGPU Radeon 8050S
Peak·FP32·FP16 5.73 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16
Socket -	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M2 Pro (10C16G)2,680

x1

Ryzen AI Max 385-

-

Show Top Score

Core Config

10 Cores 6P 4E	8 Cores 8P -
10 Threads 6P 4E	16 Threads 16P -

Clocks

Base Clock 3.5GHz	Base Clock 3.6GHz
Boost Clock -	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 128KB P 64KB E	L1d 48KB P -
L2 24MB P shared 4MB E shared	L2 1MB P - -
L3 -	L3 32MB
SLC Cache 24MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 32GB	Max Memory 128GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 256-bit	Bus Width 256-bit
Speed 6400MT/s	Speed 8000MT/s
Bandwidth 204.8GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 204.8GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 60W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU 16-Core M2 Pro	iGPU Radeon 8050S
Shaders 2048	Shaders 2048
Boost Clock 1.4GHz	Boost Clock 2.8GHz
Peak·FP32·FP16 5.73 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16

NPU

NPU Model H14 Selene	NPU Model XDNA 2
NPU Cores 16	NPU Cores 32
NPU Clock 2.1GHz	NPU Clock -
Performance 15.8 TOPSFP16	Performance 50 TOPSINT8

Chip

Manufacturer Apple	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture Apple Silicon 11ARMv8.5-A	Architecture Zen 5
Family M Series	Family Ryzen AI 300
Branding	Branding
Codename Rhodes-Chop - M2 ProVariant AvalancheP-Core BlizzardE-Core	Codename Strix Halo EldoraDie - Zen 5P-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 17, 2023	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node N5P -	Fabrication Node N4X N5SoC
Die Size 295mm²	Die Size 71mm²
Transistor Count 40 Billion	Transistor Count 8.3 Billion
Transistor Density 136 MTr/mm²	Transistor Density 118 MTr/mm²

Images

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Used In

Laptops MacBook Pro 14(M2 Pro, Early 2023)	Laptops -
Desktops Mac mini(M2 Pro, Early 2023)	Desktops Framework Desktop(Early 2025)

Competitors

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