Apple M3 (8C10G) vs Intel Core i9-13950HX Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz	24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz
TDP 30W	TDP 55W
Bandwidth 102.4GB/s LPDDR5	Bandwidth 89.6GB/s DDR5·DDR4
iGPU 10-Core M3	iGPU UHD 32EU 1650MHz Gen 12
Peak·FP32·FP16 3.42 TFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16
Socket -	Socket BGA 1964

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M3 (8C10G)3,138

x1.17

Core i9-13950HX2,680

x1

Show Top Score

Core Config

8 Cores 4P 4E	24 Cores 8P 16E
8 Threads 4P 4E	32 Threads 16P 16E

Clocks

Base Clock 4.05GHz	Base Clock 2.2GHz
Boost Clock -	Boost Clock 5.5GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 192KB P 128KB E	L1i 32KB P 64KB E
L1d 128KB P 64KB E	L1d 48KB P 32KB E
L2 16MB P shared 4MB E shared	L2 2MB P - 16MB E shared
L3 -	L3 36MB
SLC Cache 8MB	SLC Cache -

Memory

Type LPDDR5	Type DDR5·DDR4
Max Memory 24GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 6400MT/s	Speed 5600MT/s
Bandwidth 102.4GB/s	Bandwidth 89.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s

Power & Thermals

TDP 30W	TDP 55W
Peak Power -	Peak Power 157W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x6 11.8GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 10-Core M3	iGPU UHD 32EU 1650MHz Gen 12
Shaders 1280	Shaders 256
Boost Clock 1.34GHz	Boost Clock 1.65GHz
Peak·FP32·FP16 3.42 TFLOPSFP16	Peak·FP32·FP16 1.69 TFLOPSFP16

NPU

NPU Model H15 Themis	NPU Model GNA 3.0
NPU Cores 16	NPU Cores -
NPU Clock 2.36GHz	NPU Clock -
Performance 18 TOPSFP16	Performance -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 13ARMv8.6-A	Architecture Raptor Lake
Family M Series	Family Core 13th Gen
Branding	Branding
Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core	Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Oct 30, 2023	Release Date Jan 1, 2023

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N3B	Fabrication Node Intel 7
Die Size 153mm²	Die Size 257mm²
Transistor Count 25 Billion	Transistor Count 18.5 Billion
Transistor Density 164 MTr/mm²	Transistor Density 72 MTr/mm²

Images

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Used In

Laptops MacBook Pro 14(M3, Late 2023)	Laptops Blade 16(Early 2023)
All-in-Ones iMac 24(M3, Four Ports, Late 2023)	All-in-Ones -

Competitors

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