Apple M3 (8C8G-FL) vs Apple A18 Pro (Neo) Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz	6 Cores(2P+4E) 6 Threads(2P+4E) 4.04GHz
TDP 15W	TDP 5W
Bandwidth 102.4GB/s LPDDR5	Bandwidth 60GB/s LPDDR5X
iGPU 8-Core M3-FL	iGPU 5-Core A18 Pro
Peak·FP32·FP16 2.74 TFLOPSFP16	Peak·FP32·FP16 1.88 TFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M3 (8C8G-FL)3,130

x1

A18 Pro (Neo)3,409

x1.09

Show Top Score

Core Config

8 Cores 4P 4E	6 Cores 2P 4E
8 Threads 4P 4E	6 Threads 2P 4E

Clocks

Base Clock 4.05GHz	Base Clock 4.04GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 192KB P 128KB E
L1d 128KB P 64KB E	L1d 128KB P 64KB E
L2 16MB P shared 4MB E shared	L2 16MB P shared 4MB E shared
SLC Cache 8MB	SLC Cache 24MB

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 24GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 1
Bus Width 128-bit	Bus Width 64-bit
Speed 6400MT/s	Speed 7500MT/s
Bandwidth 102.4GB/s	Bandwidth 60GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 102.4GB/s	Bandwidth Calculator Channels Transfer Rate7500MT/s UC·Spec·OC 60GB/s

Power & Thermals

TDP 15W	TDP 5W
Peak Power -	Peak Power 12W
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU 8-Core M3-FL	iGPU 5-Core A18 Pro
Shaders 1024	Shaders 640
Boost Clock 1.34GHz	Boost Clock 1.47GHz
Peak·FP32·FP16 2.74 TFLOPSFP16	Peak·FP32·FP16 1.88 TFLOPSFP16

NPU

NPU Model H15 Themis	NPU Model H17 Theia
NPU Cores 16	NPU Cores 16
NPU Clock 2.36GHz	NPU Clock 2.17GHz
Performance 18 TOPSFP16	Performance 35 TOPSINT8

Chip

Manufacturer Apple	Manufacturer Apple
ISA AArch64	ISA AArch64
Architecture Apple Silicon 13ARMv8.6-A	Architecture Apple Silicon 14ARMv9.2-A
Family M Series	Family A Series
Branding	Branding
Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core	Codename Tahiti A18 ProVariant AS14PP-Core AS14EE-Core
Market Segment Tablet	Market Segment Smartphone
Release Date Oct 30, 2023	Release Date Mar 4, 2026

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node N3B	Fabrication Node N3E
Die Size 153mm²	Die Size 110mm²
Transistor Count 25B	Transistor Count 18.4B
Transistor Density 164 MTr/mm²	Transistor Density 168 MTr/mm²

Images