Apple M3 (8C9G-FL) vs Qualcomm Snapdragon 662 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.05GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz
TDP 15W	TDP 5W
Bandwidth 102.4GB/s LPDDR5	Bandwidth 14.9GB/s LPDDR4X
iGPU 9-Core M3-FL	iGPU Adreno 610
Peak·FP32·FP16 3.08 TFLOPSFP16	Peak·FP32·FP16 486.4 GFLOPSFP16

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M3 (8C9G-FL)3,130

x9.46

Snapdragon 662331

x1

Show Top Score

Core Config

8 Cores 4P 4E	8 Cores 4P 4E
8 Threads 4P 4E	8 Threads 4P 4E

Clocks

Base Clock 4.05GHz	Base Clock 2GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P 16KB E
L1d 128KB P 64KB E	L1d 32KB P 16KB E
L2 16MB P shared 4MB E shared	L2 2MB P shared 1MB E shared
SLC Cache 8MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR4X
Max Memory 24GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 32-bit
Speed 6400MT/s	Speed 3733MT/s
Bandwidth 102.4GB/s	Bandwidth 14.9GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s

Power & Thermals

TDP 15W	TDP 5W
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 4.0 x6 11.8GB/sBandwidth

-

iGPU

iGPU 9-Core M3-FL	iGPU Adreno 610
Shaders 1152	Shaders 128
Boost Clock 1.34GHz	Boost Clock 950MHz
Peak·FP32·FP16 3.08 TFLOPSFP16	Peak·FP32·FP16 486.4 GFLOPSFP16

NPU

NPU Model H15 Themis	NPU Model Hexagon 683
NPU Cores 16	NPU Cores -
NPU Clock 2.36GHz	NPU Clock -
Performance 18 TOPSFP16	Performance -

Cellular

Modem Model -	Modem Model X11
Peak Down -	Peak Down Up to 390Mbps
Peak Up -	Peak Up Up to 150Mbps

Chip

Manufacturer Apple	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture Apple Silicon 13ARMv8.6-A	Architecture Kryo 260ARMv8.0-A
Family M Series	Family 6 Series
Branding	Branding
Codename Ibiza M3Variant EverestP-Core Sawtooth E-Core	Codename - - Cortex-A73P-Core Cortex-A53E-Core
Market Segment Tablet	Market Segment Smartphone
Release Date Mar 4, 2025	Release Date Jan 20, 2020

Fabrication

Foundry TSMC	Foundry Samsung
Fabrication Node N3B	Fabrication Node 14LPP
Die Size 153mm²	Die Size -
Transistor Count 25 Billion	Transistor Count -
Transistor Density 164 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Tablets iPad Air 11" Gen 2(M3, Early 2025)iPad Air 13" Gen 2(M3, Early 2025)

Tablets Galaxy Tab A7(SD 662, Late 2020)

Competitors

AppleM3 (8C9G-FL) vs CPU AppleM4 (10C8G-FL) AppleM3 (8C9G-FL) vs CPU AppleM4 (9C10G-FL) AppleM3 (8C9G-FL) vs CPU AppleM4 (10C10G-FL) Show 12 more

QualcommSnapdragon 662 vs CPU QualcommSnapdragon 6 Gen 4 QualcommSnapdragon 662 vs CPU QualcommSnapdragon 6s Gen 3 QualcommSnapdragon 662 vs CPU GoogleTensor G5 Show 12 more