Apple M3 Ultra (28C60G) vs AMD Ryzen AI Max 385 Full Specs

Summary

28 Cores(20P+8E) 28 Threads(20P+8E) 4.05GHz	8 Cores 16 Threads 3.6GHz
TDP 300W	TDP 65W
Bandwidth 819.2GB/s LPDDR5	Bandwidth 256GB/s LPDDR5X
iGPU 60-Core M3 Ultra	iGPU Radeon 8050S
Peak·FP32·FP16 21.2 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16
Socket -	Socket FP11

Core Config

28 Cores 20P 8E	8 Cores 8P -
28 Threads 20P 8E	16 Threads 16P -

Clocks

Base Clock 4.05GHz	Base Clock 3.6GHz
Boost Clock -	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 192KB P 128KB E	L1i 32KB P -
L1d 128KB P 64KB E	L1d 48KB P -
L2 64MB P shared 4MB E shared	L2 1MB P - -
L3 -	L3 32MB
SLC Cache 96MB	SLC Cache -

Memory

Type LPDDR5	Type LPDDR5X
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 8	Channels 4
Bus Width 1024-bit	Bus Width 256-bit
Speed 6400MT/s	Speed 8000MT/s
Bandwidth 819.2GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s UC·Spec·OC 819.2GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s UC·Spec·OC 256GB/s

Power & Thermals

TDP 300W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 4.0 x32 63GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU 60-Core M3 Ultra	iGPU Radeon 8050S
Shaders 7680	Shaders 2048
Boost Clock 1.38GHz	Boost Clock 2.8GHz
Peak·FP32·FP16 21.2 TFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16

NPU

NPU Model H15 Erebus	NPU Model XDNA 2
NPU Cores 32	NPU Cores 32
NPU Clock 2.36GHz	NPU Clock -
Performance 36 TOPSFP16	Performance 50 TOPSINT8

Chip

Manufacturer Apple	Manufacturer AMD
ISA AArch64	ISA x86-64
Architecture Apple Silicon 13ARMv8.6-A	Architecture Zen 5
Family M Series	Family Ryzen AI 300
Branding	Branding
Codename Palma-D - M3 UltraVariant EverestP-Core Sawtooth E-Core	Codename Strix Halo EldoraDie - Zen 5P-Core -
Market Segment Workstation	Market Segment Laptop
Release Date Mar 5, 2025	Release Date Jan 6, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node N3B -	Fabrication Node N4X N5SoC
Die Size 954mm²	Die Size 71mm²
Transistor Count 184 Billion	Transistor Count 8.3 Billion
Transistor Density 193 MTr/mm²	Transistor Density 118 MTr/mm²

Images

Used In

Desktops Mac Studio(M3 Ultra, Early 2025)

Desktops Framework Desktop(Early 2025)

Competitors

AppleM3 Ultra (28C60G) vs CPU AppleM2 Ultra (24C60G) AppleM3 Ultra (28C60G) vs CPU AppleM2 Ultra (24C76G) AppleM3 Ultra (28C60G) vs CPU AppleM3 Ultra (32C80G) Show 12 more

AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 385 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 380 Show 12 more