Apple M5 (10C8G-FL) vs Intel Core i7-13700HX Full Specs

Summary

10 Cores(4P+6E) 10 Threads(4P+6E) 4.46GHz	16 Cores(8P+8E) 24 Threads(16P+8E) 2.1GHz
TDP 15W	TDP 55W
Bandwidth 153.6GB/s LPDDR5X	Bandwidth 76.8GB/s DDR5·DDR4
iGPU 8-Core M5-FL	iGPU UHD 32EU 1550MHz Gen 12
Peak·FP32·FP16 25.85 TOPSINT8 Tensor	Peak·FP32·FP16 1.59 TFLOPSFP16
Socket -	Socket BGA 1964

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

M5 (10C8G-FL)2,060

x1

Core i7-13700HX2,550

x1.24

Show Top Score

Core Config

10 Cores 4P 6E	16 Cores 8P 8E
10 Threads 4P 6E	24 Threads 16P 8E

Clocks

Base Clock 4.46GHz	Base Clock 2.1GHz
Boost Clock -	Boost Clock 5GHz
Overclocking Locked	Overclocking Unlocked

Cache

L1i 192KB P 128KB E	L1i 32KB P 64KB E
L1d 128KB P 64KB E	L1d 48KB P 32KB E
L2 1MB P 16MB P shared 6MB E shared	L2 2MB P - 8MB E shared
L3 -	L3 30MB
SLC Cache 8MB	SLC Cache -

Memory

Type LPDDR5X	Type DDR5·DDR4
Max Memory 32GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 9600MT/s	Speed 4800MT/s
Bandwidth 153.6GB/s	Bandwidth 76.8GB/s
Bandwidth Calculator Channels Transfer Rate9600MT/s UC·Spec·OC 153.6GB/s	Bandwidth Calculator Channels Transfer Rate4800MT/s UC·Spec·OC 76.8GB/s

Power & Thermals

TDP 15W	TDP 55W
Peak Power -	Peak Power 157W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type -	Bus Type DMI
Bus Config -	Bus Config 8 lanes
Bus Speed -	Bus Speed 16GT/s
Bus Bandwidth -	Bus Bandwidth 16GB/s

Expansion

PCIe PCIe 4.0 x5 9.8GB/sBandwidth	PCIe PCIe 5.0 x16 63GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU 8-Core M5-FL	iGPU UHD 32EU 1550MHz Gen 12
Shaders 1024	Shaders 256
Boost Clock 1.58GHz	Boost Clock 1.55GHz
Peak·FP32·FP16 25.85 TOPSINT8 Tensor	Peak·FP32·FP16 1.59 TFLOPSFP16

NPU

NPU Model H17 Theia	NPU Model GNA 3.0
NPU Cores 16	NPU Cores -
NPU Clock 2.45GHz	NPU Clock -
Performance 38 TOPSINT8	Performance -

Chip

Manufacturer Apple	Manufacturer Intel
ISA AArch64	ISA x86-64
Architecture Apple Silicon 15ARMv9.2-A	Architecture Raptor Lake
Family M Series	Family Core 13th Gen
Branding	Branding
Codename Hidra M5Variant AS15PP-Core AS15EE-Core	Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core
Market Segment Tablet	Market Segment Laptop
Release Date Mar 3, 2026	Release Date Jan 1, 2023

Fabrication

Foundry TSMC	Foundry Intel
Fabrication Node N3P	Fabrication Node Intel 7
Die Size -	Die Size 257mm²
Transistor Count -	Transistor Count 18.5B
Transistor Density -	Transistor Density 72 MTr/mm²

Images