CPUs

Apple S7 vs Qualcomm Snapdragon Wear 4100+ Full Specs

2 Cores
2 Threads
1.73GHz
5 Cores(4P+1E)
5 Threads(4P+1E)
2GHz
TDP
2W
TDP
3W
Bandwidth
12.8GB/s
LPDDR4
Bandwidth
6GB/s
LPDDR3
iGPU
iGPU
··
86.4 GFLOPSFP16
··
76.8 GFLOPSFP16

S7S712.8GB/s
x2.13
Snapdragon Wear 4100+Snapdragon Wear 4100+6GB/s
x1

2 Cores
2P
-
5 Cores
4P
1E
2 Threads
2P
-
5 Threads
4P
1E

Base Clock
1.73GHz
Base Clock
2GHz
Overclocking
Locked
Overclocking
Locked

L1i
96KB P
L1i
-
L1d
48KB P
L1d
-
L2
4MB P shared
L2
-
-
SLC Cache
1MB
SLC Cache
-

Type
LPDDR4
Type
LPDDR3
Max Memory
1.5GB
Max Memory
-
ECC
No
ECC
No
Channels
1
Channels
1
Bus Width
32-bit
Bus Width
32-bit
Speed
3200MT/s
Speed
1500MT/s
Bandwidth
12.8GB/s
Bandwidth
6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
6GB/s

TDP
2W
TDP
3W

iGPU
iGPU
Shaders
64
Shaders
48
Boost Clock
675MHz
Boost Clock
400MHz
··
86.4 GFLOPSFP16
··
76.8 GFLOPSFP16

NPU Model
H11 Mercury
NPU Model
-
NPU Cores
2
NPU Cores
-
Performance
2 TOPSFP16
Performance
-

Modem Model
-
Modem Model
X5
Peak Down
-
Peak Down
Up to 150Mbps
Peak Up
-
Peak Up
Up to 50Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
S7  branding
Branding
Snapdragon  branding
Codename
Turks
ThunderP-Core
-
Codename
-
Cortex-A53P-Core
Cortex-M0E-Core
Market Segment
Smartwatch
Market Segment
Smartwatch
Release Date
Oct 15, 2021
Release Date
Apr 1, 2020

Foundry
TSMC
Foundry
Samsung
Fabrication Node
N7P
Fabrication Node
28nm LP
Die Size
40mm²
Die Size
-
Transistor Count
3.5 Billion
Transistor Count
-
Transistor Density
88 MTr/mm²
Transistor Density
-

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