HiSilicon Kirin 658 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2.35GHz

TDP 5W

Bandwidth 14.9GB/s LPDDR3

iGPU Mali-T830 MP2 900MHz

Peak·FP32·FP16 36 GFLOPSFP32

Core Config

8 Cores 4P 4E

8 Threads 4P 4E

Clocks

Base Clock 2.35GHz

Overclocking Locked

Cache

L1i 16KB P 16KB E

L1d 16KB P 16KB E

L2 128KB E 1MB P shared

Memory

Type LPDDR3

ECC No

Channels 2

Bus Width 64-bit

Speed 1866MT/s

Bandwidth 14.9GB/s

Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 14.9GB/s

Power & Thermals

TDP 5W

iGPU

iGPU Mali-T830 MP2 900MHz

Shaders 20

Boost Clock 900MHz

Peak·FP32·FP16 36 GFLOPSFP32

Cellular

Modem Model Balong 720

Peak Down Up to 300Mbps

Peak Up Up to 50Mbps

Chip

Manufacturer HiSilicon

ISA AArch64

Architecture ARMv8.0-A

Branding

Codename Cortex-A53P-Core Cortex-A53E-Core

Market Segment Smartphone

Release Date May 1, 2017

Fabrication

Foundry Samsung

Fabrication Node 28nm LP

Images

No images available

Competitors

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