CPUs

HiSilicon Kirin 710 vs Qualcomm Snapdragon 8 Elite Gen 5 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2.2GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
4.6GHz
TDP
5W
TDP
5W
Bandwidth
9.6GB/s
·
Bandwidth
84.8GB/s
LPDDR5X
iGPU
iGPU
··
192 GFLOPSFP16
··
7.37 TFLOPSFP16

Kirin 710Kirin 710332
x1
Snapdragon 8 Elite Gen 5Snapdragon 8 Elite Gen 5-
-

8 Cores
4P
4E
8 Cores
2P
6E
8 Threads
4P
4E
8 Threads
2P
6E

Base Clock
2.2GHz
Base Clock
4.6GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
16KB E
L1i
128KB P
64KB E
L1d
32KB P
16KB E
L1d
64KB P
64KB E
L2
256KB P
128KB E
-
-
L2
12MB P shared
12MB E shared
SLC Cache
-
SLC Cache
8MB

Type
·
Type
LPDDR5X
Max Memory
-
Max Memory
24GB
ECC
No
ECC
No
Channels
1
Channels
4
Bus Width
32-bit
Bus Width
64-bit
Speed
2400MT/s
Speed
10600MT/s
Bandwidth
9.6GB/s
Bandwidth
84.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
9.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
84.8GB/s

TDP
5W
TDP
5W
Peak Power
-
Peak Power
19W

iGPU
iGPU
Shaders
48
Shaders
1536
Boost Clock
1GHz
Boost Clock
1.2GHz
··
192 GFLOPSFP16
··
7.37 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon

Modem Model
Balong 750
Modem Model
X85
Cellular
LTE
Cellular
5G mmWave
Peak Down
Up to 600Mbps
Peak Down
Up to 12.5Gbps
Peak Up
Up to 150Mbps
Peak Up
Up to 3.7Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Oryon 3ARMv8.7-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 8 Elite Gen 5  branding
Codename
-
Cortex-A73P-Core
Cortex-A53E-Core
Codename
Snapdragon 8 Elite Gen 5Variant
Pegasus-PP-Core
Pegasus-EE-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Aug 1, 2018
Release Date
Sep 24, 2025

Foundry
Samsung
Foundry
TSMC
Fabrication Node
28nm LP
Fabrication Node
N3E
Die Size
-
Die Size
126mm²

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