HiSilicon Kirin 9000S vs Qualcomm Snapdragon 8s Gen 3 Full Specs - HMC

8 Cores(1P+3M+4E) 12 Threads(2P+6M+4E) 2.62GHz	8 Cores(1P+4M+3E) 8 Threads(1P+4M+3E) 3GHz
TDP 5W	TDP 5W
Bandwidth 67.2GB/s LPDDR5X	Bandwidth 67.2GB/s LPDDR5X
iGPU Maleoon 910	iGPU Adreno 735
·· 3.07 TFLOPSFP16	·· 3.38 TFLOPSFP16

Kirin 9000S

Kirin 9000S67.2GB/s

x1

Snapdragon 8s Gen 3

Snapdragon 8s Gen 367.2GB/s

x1

8 Cores 1P 3M 4E	8 Cores 1P 4M 3E
12 Threads 2P 6M 4E	8 Threads 1P 4M 3E

Base Clock 2.62GHz	Base Clock 3GHz
Overclocking Locked	Overclocking Locked

L1i 64KB P 64KB M 32KB E	L1i 64KB P 64KB M 32KB E
L1d 64KB P 64KB M 32KB E	L1d 64KB P 64KB M 32KB E
L2 512KB P 256KB M 128KB E	L2 1MB P 512KB M 128KB E
L3 -	L3 8MB
SLC Cache -	SLC Cache 4MB

Type LPDDR5X	Type LPDDR5X
Max Memory 16GB	Max Memory 24GB
ECC No	ECC No
Channels 4	Channels 4
Bus Width 64-bit	Bus Width 64-bit
Speed 8400MT/s	Speed 8400MT/s
Bandwidth 67.2GB/s	Bandwidth 67.2GB/s
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 67.2GB/s	Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 67.2GB/s

TDP

5W

TDP

5W

iGPU Maleoon 910	iGPU Adreno 735
Shaders 1024	Shaders 768
Boost Clock 750MHz	Boost Clock 1.1GHz
·· 3.07 TFLOPSFP16	·· 3.38 TFLOPSFP16

NPU Model -	NPU Model Hexagon
Performance -	Performance 45 TOPSINT8

Modem Model Balong 5000	Modem Model X70
Cellular 5G	Cellular 5G mmWave
Peak Down Up to 4.6Gbps	Peak Down Up to 10.0Gbps
Peak Up Up to 2.5Gbps	Peak Up Up to 3.5Gbps

Manufacturer HiSilicon	Manufacturer Qualcomm
ISA AArch64	ISA AArch64
Architecture TaishanARMv8.2-A	Architecture KryoARMv9.2-A
Family -	Family 8 Series
Branding	Branding
Codename - Taishan V120P-Core Taishan V120M-Core Cortex-A510E-Core	Codename Snapdragon 8s Gen 3Variant Cortex-X4P-Core Cortex-A720M-Core Cortex-A520E-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Apr 1, 2024	Release Date Mar 1, 2024

Foundry SMIC	Foundry TSMC
Fabrication Node N+2	Fabrication Node N4P
Die Size -	Die Size 90mm²

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