CPUs

HiSilicon Kirin 930 vs Qualcomm Snapdragon 6 Gen 4 Full Specs

8 Cores(4P+4E)
8 Threads(4P+4E)
2GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
2.3GHz
TDP
5W
TDP
5W
Bandwidth
12.8GB/s
LPDDR3
Bandwidth
25.6GB/s
·
iGPU
iGPU
··
48 GFLOPSFP32
··
1.07 TFLOPSFP16

Kirin 930Kirin 93012.8GB/s
x1
Snapdragon 6 Gen 4Snapdragon 6 Gen 425.6GB/s
x2.00

8 Cores
4P
-
4E
8 Cores
1P
3M
4E
8 Threads
4P
-
4E
8 Threads
1P
3M
4E

Base Clock
2GHz
Base Clock
2.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
16KB P
-
16KB E
L1i
64KB P
64KB M
32KB E
L1d
16KB P
-
16KB E
L1d
64KB P
64KB M
32KB E
L2
-
-
128KB E
1MB P shared
L2
512KB P
512KB M
128KB E
-

Type
LPDDR3
Type
·
Max Memory
-
Max Memory
16GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
64-bit
Bus Width
32-bit
Speed
1600MT/s
Speed
6400MT/s
Bandwidth
12.8GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
12.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
25.6GB/s

TDP
5W
TDP
5W

iGPU
iGPU
Shaders
40
Shaders
256
Boost Clock
600MHz
Boost Clock
1.05GHz
··
48 GFLOPSFP32
··
1.07 TFLOPSFP16

NPU Model
-
NPU Model
Hexagon

Modem Model
Balong 720
Modem Model
X63S
Cellular
LTE
Cellular
5G mmWave
Peak Down
Up to 300Mbps
Peak Down
Up to 2.9Gbps
Peak Up
Up to 50Mbps
Peak Up
Up to 1.6Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv9-A
Family
-
Family
Branding
Kirin  branding
Branding
Snapdragon 6 Gen 4  branding
Codename
Cortex-A53P-Core
-
Cortex-A53E-Core
Codename
Cortex-A720P-Core
Cortex-A720M-Core
Cortex-A520E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Feb 1, 2015
Release Date
Feb 12, 2025

Foundry
Samsung
Foundry
TSMC
Fabrication Node
28nm LP
Fabrication Node
N6

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