HiSilicon Kirin 970 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2.36GHz

TDP 5W

Bandwidth 29.9GB/s LPDDR4X

iGPU Mali-G72 MP12 746MHz

Peak·FP32·FP16 429.7 GFLOPSFP16

Core Config

8 Cores 4P 4E

8 Threads 4P 4E

Clocks

Base Clock 2.36GHz

Overclocking Locked

Cache

L1i 32KB P 16KB E

L1d 32KB P 16KB E

L2 256KB P 128KB E

Memory

Type LPDDR4X

ECC No

Channels 4

Bus Width 64-bit

Speed 3733MT/s

Bandwidth 29.9GB/s

Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W

iGPU

iGPU Mali-G72 MP12 746MHz

Shaders 144

Boost Clock 746MHz

Peak·FP32·FP16 429.7 GFLOPSFP16

Cellular

Modem Model HS LTE 18

Peak Down Up to 1.2Gbps

Peak Up Up to 150Mbps

Chip

Manufacturer HiSilicon

ISA AArch64

Architecture ARMv8.0-A

Branding

Codename Cortex-A73P-Core Cortex-A53E-Core

Market Segment Smartphone

Release Date Oct 1, 2017

Fabrication

Foundry Samsung

Fabrication Node 28nm LP

Images

No images available

Competitors

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