IBM Corona Full Specs

Summary

3 Cores 6 Threads 3.2GHz

TDP 120W

iGPU Xenos E

Peak·FP32·FP16 240 GFLOPSFP32

Core Config

3 Cores

6 Threads

Clocks

Base Clock 3.2GHz

Overclocking Locked

Cache

L1i 32KB

L1d 32KB

L2 1MB shared

Memory

ECC -

Power & Thermals

TDP 120W

Chipset Bus

Bus Type FSB

Bus Config 64-bit

Bus Speed 1.35GT/s

Bus Bandwidth 10.8GB/s

iGPU

iGPU Xenos E

Shaders 240

Boost Clock 500MHz

Peak·FP32·FP16 240 GFLOPSFP32

Chip

Manufacturer IBM

ISA PowerPC

Architecture Cell PPE

Branding

Codename Corona WaternooseP-Core

Market Segment Console

Release Date Jun 10, 2013

Fabrication

Foundry GlobalFoundries

Fabrication Node 45nm

Die Size 168mm²

Transistor Count 372 Million

Transistor Density 2 MTr/mm²

Images

Used In

Game Consoles Xbox 360 E

Competitors

IBMCorona vs CPU AMDLockhart