Intel Atom x3-C3295RK vs Apple A18 Pro (Neo) Full Specs

Summary

4 Cores 4 Threads -	6 Cores(2P+4E) 6 Threads(2P+4E) 4.04GHz
TDP 2W	TDP 5W
Bandwidth 5.3GB/s DDR3·DDR3L·LPDDR3	Bandwidth 60GB/s LPDDR5X
iGPU Mali-450 MP4 600MHz	iGPU 5-Core A18 Pro
Peak·FP32·FP16 19.2 GFLOPSFP32	Peak·FP32·FP16 1.88 TFLOPSFP16
Socket BGA 361	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Atom x3-C3295RK130

x1

A18 Pro (Neo)3,409

x26.22

Show Top Score

Core Config

4 Cores 4P -	6 Cores 2P 4E
4 Threads 4P -	6 Threads 2P 4E

Clocks

Base Clock -	Base Clock 4.04GHz
Boost Clock 1.1GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 24KB P -	L1d 128KB P 64KB E
L2 1MB P shared -	L2 16MB P shared 4MB E shared
SLC Cache -	SLC Cache 24MB

Memory

Type DDR3·DDR3L·LPDDR3	Type LPDDR5X
Max Memory 2GB	Max Memory 8GB
ECC No	ECC No
Channels 1	Channels 1
Bus Width 32-bit	Bus Width 64-bit
Speed 1333MT/s	Speed 7500MT/s
Bandwidth 5.3GB/s	Bandwidth 60GB/s
Bandwidth Calculator Channels Transfer Rate1333MT/s Calculated Bandwidth 5.3GB/s	Bandwidth Calculator Channels Transfer Rate7500MT/s Calculated Bandwidth 60GB/s

Power & Thermals

TDP 2W	TDP 5W
Peak Power -	Peak Power 12W
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

-	PCIe PCIe 4.0 x6 11.8GB/sBandwidth

iGPU

iGPU Mali-450 MP4 600MHz	iGPU 5-Core A18 Pro
Shaders 16	Shaders 640
Boost Clock 600MHz	Boost Clock 1.47GHz
Peak·FP32·FP16 19.2 GFLOPSFP32	Peak·FP32·FP16 1.88 TFLOPSFP16

NPU

NPU Model -	NPU Model H17 Theia
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.17GHz
Performance -	Performance 35 TOPSINT8

Cellular

Modem Model Atom 3G	Modem Model -
Peak Down Up to 7.2Mbps	Peak Down -
Peak Up Up to 5.8Mbps	Peak Up -

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Silvermont	Architecture Apple Silicon 14ARMv9.2-A
Family Atom	Family A Series
Branding	Branding
Codename SoFIA - - -	Codename Tahiti A18 ProVariant AS14PP-Core AS14EE-Core
Market Segment Smartphone	Market Segment Smartphone
Release Date Oct 1, 2016	Release Date Mar 4, 2026

Fabrication

Foundry TSMC	Foundry TSMC
Fabrication Node 28nm	Fabrication Node N3E
Die Size -	Die Size 110mm²
Transistor Count -	Transistor Count 18.4 Billion
Transistor Density -	Transistor Density 168 MTr/mm²

Images

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Used In

Laptops -

Laptops MacBook Neo(Early 2026)

Competitors

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