Intel Atom Z3570 vs MediaTek MT8161 Full Specs
4 Cores 4 Threads 2GHz | 4 Cores 4 Threads 1.3GHz |
Bandwidth 12.8GB/s LPDDR3 | Bandwidth 12.8GB/s DDR3L |
iGPU | iGPU |
·· 245.8 GFLOPSFP16 | ·· 20 GFLOPSFP32 |
Socket | Socket - |
4 Cores | 4 Cores |
4 Threads | 4 Threads |
Base Clock 2GHz | Base Clock 1.3GHz |
Overclocking Locked | Overclocking Locked |
L1i 32KB | L1i 16KB |
L1d 24KB | L1d 16KB |
L2 2MB shared | L2 1MB shared |
Type LPDDR3 | Type DDR3L |
Max Memory 4GB | Max Memory - |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 64-bit | Bus Width 64-bit |
Speed 1600MT/s | Speed 1600MT/s |
Bandwidth 12.8GB/s | Bandwidth 12.8GB/s |
Bandwidth Calculator Channels Transfer Rate ·· | Bandwidth Calculator Channels Transfer Rate ·· |
Max Operating Temp 90°C Max | Max Operating Temp - |
iGPU | iGPU |
Shaders 128 | Shaders 20 |
Boost Clock 640MHz | Boost Clock 500MHz |
·· 245.8 GFLOPSFP16 | ·· 20 GFLOPSFP32 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture |
Family | Family - |
Branding ![]() | Branding ![]() |
Codename Moorefield AnniedaleDie - | Codename - - Cortex-A53P-Core |
Market Segment Smartphone | Market Segment Smartphone |
Release Date Sep 1, 2015 | Release Date May 1, 2015 |
Foundry Intel | Foundry Samsung |
Fabrication Node 22nm | Fabrication Node 28nm LP |
Die Size 100mm² | Die Size - |
Transistor Count 800 Million | Transistor Count - |
Transistor Density 8 MTr/mm² | Transistor Density - |



