Intel Core 2 Duo P7350 vs Intel Core Ultra 5 226V Full Specs

Summary

2 Cores 2 Threads 2GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2.1GHz
TDP 25W	TDP 17W
Bandwidth -	Bandwidth 136.5GB/s LPDDR5X
iGPU -	iGPU Arc 130V 1850MHz
Peak·FP32·FP16 -	Peak·FP32·FP16 106.1 TOPSINT4 Tensor
Socket Socket P	Socket BGA 2833

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core 2 Duo P7350254

x1

Core Ultra 5 226V2,543

x10.01

Show Top Score

Core Config

2 Cores 2P -	8 Cores 4P 4E
2 Threads 2P -	8 Threads 4P 4E

Clocks

Base Clock 2GHz	Base Clock 2.1GHz
Boost Clock -	Boost Clock 4.5GHz
Overclocking Locked	Overclocking Locked

Cache

L0i -	L0i 64KB
L0d -	L0d 48KB
L1i 32KB P -	L1i - 64KB E
L1d 32KB P -	L1d 192KB P 32KB E
L2 3MB P shared -	L2 2.5MB P - 4MB E shared
L3 -	L3 8MB

Memory

Type -	Type LPDDR5X
Max Memory -	Max Memory 16GB
ECC -	ECC No
Channels -	Channels 2
Bus Width -	Bus Width 128-bit
Speed -	Speed 8533MT/s
Bandwidth -	Bandwidth 136.5GB/s
Bandwidth Calculator -	Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 136.5GB/s

Power & Thermals

TDP 25W	TDP 17W
cTDP-down -	cTDP-down 8W
Peak Power -	Peak Power 37W
Max Operating Temp -	Max Operating Temp 100°C Max
Voltage Range -	Voltage Range -

Chipset Bus

Bus Type FSB	Bus Type -
Bus Config 64-bit	Bus Config -
Bus Speed 1.066GT/s	Bus Speed -
Bus Bandwidth 8.5GB/s	Bus Bandwidth -

Expansion

-	PCIe PCIe 5.0 x4 15.8GB/sBandwidth
-	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU -	iGPU Arc 130V 1850MHz
Shaders -	Shaders 896
Boost Clock -	Boost Clock 1.85GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 106.1 TOPSINT4 Tensor

NPU

NPU Model -	NPU Model AI Boost 4
NPU Cores -	NPU Cores 5
Performance -	Performance 40 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Penryn	Architecture Lunar Lake
Family Core 2	Family Core Ultra Series 2
Branding	Branding
Codename Penryn-3M - - -	Codename Lunar Lake-V Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jul 15, 2008	Release Date Sep 3, 2024
Part Number AW80576GH0413M, AW80577SH0413M	Part Number QQ8076606107, QQ8076606108
S-Spec SLB44 (C0), SLB53 (M0)	S-Spec SRPMQ, SRPMR
	Official specs

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries -	Other Foundries IntelFIB TSMCIO
Fabrication Node 45nm - -	Fabrication Node N3B 22nmFIB N6IO
Die Size 82mm² -	Die Size 140mm² 46mm²IO
Transistor Count 228M	Transistor Count -
Transistor Density 3 MTr/mm²	Transistor Density -

Images