Intel Core i3-1000NG4 vs AMD Ryzen AI 7 PRO 350 Full Specs

Summary

2 Cores 4 Threads 1.1GHz	8 Cores(4P+4E) 16 Threads(8P+8E) 2GHz
TDP 9W	TDP 28W
Bandwidth 59.7GB/s LPDDR4	Bandwidth 128GB/s LPDDR5X·DDR5
iGPU Iris Plus 48EU 900MHz	iGPU Radeon 860M 3000MHz
Peak·FP32·FP16 1.38 TFLOPSFP16	Peak·FP32·FP16 4.61 TFLOPSFP16
Socket BGA 1377	Socket FP8

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i3-1000NG41,126

x1

Ryzen AI 7 PRO 350-

-

Show Top Score

Core Config

2 Cores 2P -	8 Cores 4P 4E
4 Threads 4P -	16 Threads 8P 8E

Clocks

Base Clock 1.1GHz	Base Clock 2GHz
Boost Clock 3.2GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P	L1i 32KB P
L1d 48KB P	L1d 48KB P
L2 512KB P	L2 1MB P
L3 4MB	L3 16MB

Memory

Type LPDDR4	Type LPDDR5X·DDR5
Max Memory 32GB	Max Memory 256GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 3733MT/s	Speed 8000MT/s
Bandwidth 59.7GB/s	Bandwidth 128GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 128GB/s

Power & Thermals

TDP 9W	TDP 28W
cTDP-down -	cTDP-down 15W
cTDP-up -	cTDP-up 54W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type OPI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 16GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU Iris Plus 48EU 900MHz	iGPU Radeon 860M 3000MHz
Shaders 384	Shaders 384
Boost Clock 900MHz	Boost Clock 3GHz
Peak·FP32·FP16 1.38 TFLOPSFP16	Peak·FP32·FP16 4.61 TFLOPSFP16

NPU

NPU Model GNA 1.0	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance -	Performance 50 TOPSINT8

Controller

Controller Model 495 Series Y+	Controller Model -
Codename Ice Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Ice Lake	Architecture Zen 5
Family Core 10th Gen	Family Ryzen AI 300
Branding	Branding
Codename Ice Lake-Y Sunny CoveP-Core -	Codename Strix Point Zen 5P-Core Zen 5cE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Mar 18, 2020	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 10nm+ 14nmPCH	Fabrication Node N4P -
Die Size 122mm² 54mm²PCH	Die Size 233mm² -
Transistor Count 7 Billion	Transistor Count 28 Billion
Transistor Density 57 MTr/mm²	Transistor Density 120 MTr/mm²

Images

No images available

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Used In

Laptops MacBook Air 13(Early 2020)

Laptops -

Competitors

IntelCore i3-1000NG4 vs CPU AMDRyzen AI 5 PRO 340 IntelCore i3-1000NG4 vs CPU AMDRyzen AI 5 340 IntelCore i3-1000NG4 vs CPU AMDRyzen AI 7 350 Show 6 more

AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen AI 7 350 AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen 9 270 AMDRyzen AI 7 PRO 350 vs CPU AMDRyzen 7 250 Show 12 more