Intel Core i3-1005G1 vs Qualcomm Snapdragon 662 Full Specs

Summary

2 Cores 4 Threads 1.2GHz	8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz
TDP 15W	TDP 5W
Bandwidth 59.7GB/s LPDDR4·DDR4	Bandwidth 14.9GB/s LPDDR4X
iGPU UHD 32EU 900MHz Gen 11	iGPU Adreno 610
Peak·FP32·FP16 921.6 GFLOPSFP16	Peak·FP32·FP16 486.4 GFLOPSFP16
Socket BGA 1526	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-1005G11,304

x3.94

Snapdragon 662331

x1

Show Top Score

Core Config

2 Cores 2P -	8 Cores 4P 4E
4 Threads 4P -	8 Threads 4P 4E

Clocks

Base Clock 1.2GHz	Base Clock 2GHz
Boost Clock 3.4GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 32KB P 16KB E
L1d 48KB P -	L1d 32KB P 16KB E
L2 512KB P - -	L2 2MB P shared 1MB E shared
L3 4MB	L3 -

Memory

Type LPDDR4·DDR4	Type LPDDR4X
Max Memory 32GB	Max Memory 8GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 32-bit
Speed 3733MT/s	Speed 3733MT/s
Bandwidth 59.7GB/s	Bandwidth 14.9GB/s
Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 59.7GB/s	Bandwidth Calculator Channels Transfer Rate3733MT/s Calculated Bandwidth 14.9GB/s

Power & Thermals

TDP 15W	TDP 5W
cTDP-down 13W	cTDP-down -
cTDP-up 25W	cTDP-up -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type OPI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 4GT/s	Bus Speed -
Bus Bandwidth 2GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

-

iGPU

iGPU UHD 32EU 900MHz Gen 11	iGPU Adreno 610
Shaders 256	Shaders 128
Boost Clock 900MHz	Boost Clock 950MHz
Peak·FP32·FP16 921.6 GFLOPSFP16	Peak·FP32·FP16 486.4 GFLOPSFP16

NPU

NPU Model GNA 1.0

NPU Model Hexagon 683

Cellular

Modem Model -	Modem Model X11
Peak Down -	Peak Down Up to 390Mbps
Peak Up -	Peak Up Up to 150Mbps

Controller

Controller Model 495 Series U+	Controller Model -
Codename Ice Lake	Codename -
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Ice Lake	Architecture Kryo 260ARMv8.0-A
Family Core 10th Gen	Family 6 Series
Branding	Branding
Codename Ice Lake-U Sunny CoveP-Core -	Codename - Cortex-A73P-Core Cortex-A53E-Core
Market Segment Laptop	Market Segment Smartphone
Release Date Aug 1, 2019	Release Date Jan 20, 2020

Fabrication

Foundry Intel	Foundry Samsung
Other Foundries IntelPCH	Other Foundries -
Fabrication Node 10nm+ 14nmPCH	Fabrication Node 14LPP -
Die Size 122mm² 54mm²PCH	Die Size -
Transistor Count 7 Billion	Transistor Count -
Transistor Density 57 MTr/mm²	Transistor Density -

Images

No images available

No images available

Used In

Tablets Surface Pro 7(Intel 10th Gen, Late 2019)

Tablets Galaxy Tab A7(SD 662, Late 2020)

Competitors

CPU IntelCore i3-1005G1 vs CPU IntelCore Ultra 5 235UA CPU IntelCore i3-1005G1 vs CPU IntelCore Ultra 5 235H CPU IntelCore i3-1005G1 vs CPU AMDRyzen AI 7 PRO 350 Show 9 more

QualcommSnapdragon 662 vs CPU QualcommSnapdragon 6 Gen 4 QualcommSnapdragon 662 vs CPU GoogleTensor G5 QualcommSnapdragon 662 vs CPU AppleA18 Pro (Neo) Show 12 more