Intel Core i3-10100Y vs Intel Core i5-10210Y Full Specs

Summary

2 Cores 4 Threads 1.3GHz	4 Cores 8 Threads 1GHz
TDP 5W	TDP 7W
Bandwidth 29.9GB/s LPDDR3·DDR3L	Bandwidth 29.9GB/s LPDDR3·DDR3L
iGPU UHD 615 1000MHz	iGPU UHD 24EU 1050MHz Gen 9.5
Peak·FP32·FP16 384 GFLOPSFP16	Peak·FP32·FP16 403.2 GFLOPSFP16
Socket BGA 1515	Socket BGA 1515

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-10100Y975

x1

Core i5-10210Y990

x1.02

Show Top Score

Core Config

2 Cores	4 Cores
4 Threads	8 Threads

Clocks

Base Clock 1.3GHz	Base Clock 1GHz
Boost Clock 3.9GHz	Boost Clock 4GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 256KB	L2 256KB
L3 4MB	L3 6MB

Memory

Type LPDDR3·DDR3L	Type LPDDR3·DDR3L
Max Memory 16GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1866MT/s	Speed 1866MT/s
Bandwidth 29.9GB/s	Bandwidth 29.9GB/s
Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s	Bandwidth Calculator Channels Transfer Rate1866MT/s Calculated Bandwidth 29.9GB/s

Power & Thermals

TDP 5W	TDP 7W
cTDP-down 4W	cTDP-down 6W
cTDP-up 7W	cTDP-up 9W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type OPI	Bus Type OPI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 4GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 2GB/s

Expansion

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

PCIe PCIe 3.0 x10 9.8GB/sBandwidth

iGPU

iGPU UHD 615 1000MHz	iGPU UHD 24EU 1050MHz Gen 9.5
Shaders 192	Shaders 192
Boost Clock 1GHz	Boost Clock 1.05GHz
Peak·FP32·FP16 384 GFLOPSFP16	Peak·FP32·FP16 403.2 GFLOPSFP16

Controller

Controller Model 300 Series Y+	Controller Model 300 Series Y+
Codename Amber Lake	Codename Amber Lake
PCIe -	PCIe -

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Skylake
Family Core 10th Gen	Family Core 10th Gen
Branding	Branding
Codename Kaby Lake-H Kaby Lake-2C-GT2Variant	Codename Amber Lake-Y Amber Lake-4CVariant
Market Segment Laptop	Market Segment Laptop
Release Date Jan 3, 2021	Release Date Jan 3, 2021

Fabrication

Foundry Intel	Foundry Intel
Other Foundries IntelPCH	Other Foundries IntelPCH
Fabrication Node 14nm+ 22nmPCH	Fabrication Node 14nm++ 22nmPCH
Die Size 103mm² 52mm²PCH	Die Size 123mm² 52mm²PCH
Transistor Count 1.8 Billion	Transistor Count 2.1 Billion
Transistor Density 17 MTr/mm²	Transistor Density 17 MTr/mm²

Images

No images available

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Used In

Tablets Surface Go 3(Amber Lake-R, Late 2021)

Tablets -

Competitors

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IntelCore i5-10210Y vs CPU AMDRyzen AI 5 PRO 340 IntelCore i5-10210Y vs CPU AMDRyzen AI 5 340 IntelCore i5-10210Y vs CPU AMDRyzen 3 PRO 210 Show 12 more