Intel Core i3-7100H vs Intel Core Ultra 5 235UA Full Specs

Summary

2 Cores 4 Threads 3GHz	12 Cores(2P+8M+2E) 14 Threads(4P+8M+2E) 2GHz
TDP 35W	TDP 15W
Bandwidth 38.4GB/s DDR4·LPDDR3·DDR3L	Bandwidth 134.4GB/s LPDDR5X·DDR5
iGPU HD 630 950MHz	iGPU Graphics 4C 2050MHz
Peak·FP32·FP16 364.8 GFLOPSFP16	Peak·FP32·FP16 4.2 TFLOPSFP16
Socket BGA 1440	Socket BGA 2049

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i3-7100H895

x1

Core Ultra 5 235UA-

-

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Core Config

2 Cores 2P - -	12 Cores 2P 8M 2E
4 Threads 4P - -	14 Threads 4P 8M 2E

Clocks

Base Clock 3GHz	Base Clock 2GHz
Boost Clock -	Boost Clock 4.9GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P - -	L1i 64KB P 64KB M 64KB E
L1d 32KB P - -	L1d 48KB P 32KB M 32KB E
L2 256KB P - -	L2 3MB P 8MB M shared 8MB E shared
L3 3MB	L3 36MB

Memory

Type DDR4·LPDDR3·DDR3L	Type LPDDR5X·DDR5
Max Memory 64GB	Max Memory 96GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2400MT/s	Speed 8400MT/s
Bandwidth 38.4GB/s	Bandwidth 134.4GB/s
Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s	Bandwidth Calculator Channels Transfer Rate8400MT/s Calculated Bandwidth 134.4GB/s

Power & Thermals

TDP 35W	TDP 15W
cTDP-down -	cTDP-down 12W
Peak Power -	Peak Power 57W
Max Operating Temp 100°C Max	Max Operating Temp 110°C Max

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 8GT/s	Bus Speed -
Bus Bandwidth 4GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 4.0 x20 39.4GB/sBandwidth

iGPU

iGPU HD 630 950MHz	iGPU Graphics 4C 2050MHz
Shaders 192	Shaders 512
Boost Clock 950MHz	Boost Clock 2.05GHz
Peak·FP32·FP16 364.8 GFLOPSFP16	Peak·FP32·FP16 4.2 TFLOPSFP16

NPU

NPU Model -	NPU Model AI Boost 3
NPU Cores -	NPU Cores 2
Performance -	Performance 13 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Arrow Lake
Family Core 7th Gen	Family Core Ultra Series 2
Branding	Branding
Codename Kaby Lake-H Kaby Lake-2C-GT2Variant - - -	Codename Arrow Lake-U Arrow Lake-U-2P-8EVariant Redwood CoveP-Core CrestmontM-Core CrestmontE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 3, 2017	Release Date Jul 31, 2025

Fabrication

Foundry Intel	Foundry Intel
Other Foundries -	Other Foundries TSMCiGPU TSMCIO TSMCSoC
Fabrication Node 14nm+ - - -	Fabrication Node Intel 3 N5iGPU N6IO N6SoC
Die Size 103mm² - - -	Die Size - 23mm²iGPU 10mm²IO 100mm²SoC
Transistor Count 1.8 Billion	Transistor Count -
Transistor Density 17 MTr/mm²	Transistor Density -

Images

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Competitors

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