Intel Core i3-8121U vs Intel Core i7-8709G Full Specs

Summary

2 Cores 4 Threads 2.2GHz	4 Cores 8 Threads 3.1GHz
TDP 15W	TDP 100W
Bandwidth 38.4GB/s DDR4·LPDDR4	Bandwidth 38.4GB/s DDR4
iGPU 0	iGPU Radeon RX Vega M GH
Peak·FP32·FP16 -	Peak·FP32·FP16 3.66 TFLOPSFP16
Socket BGA 1356	Socket BGA 2270

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 TDP

Core i3-8121U1,163

x1

Core i7-8709G1,369

x1.18

Show Top Score

Core Config

2 Cores	4 Cores
4 Threads	8 Threads

Clocks

Base Clock 2.2GHz	Base Clock 3.1GHz
Boost Clock 3.2GHz	Boost Clock 4.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 32KB
L2 256KB	L2 256KB
L3 4MB	L3 8MB

Memory

Type DDR4·LPDDR4	Type DDR4
Max Memory 32GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 2400MT/s	Speed 2400MT/s
Bandwidth 38.4GB/s	Bandwidth 38.4GB/s
Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s	Bandwidth Calculator Channels Transfer Rate2400MT/s Calculated Bandwidth 38.4GB/s

Power & Thermals

TDP 15W	TDP 100W
Max Operating Temp 105°C Max	Max Operating Temp 100°C Max
Included Cooler 0	Included Cooler -

Chipset Bus

Bus Type OPI	Bus Type DMI
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 4GT/s	Bus Speed 8GT/s
Bus Bandwidth 2GB/s	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 3.0 x8 7.9GB/sBandwidth

iGPU

iGPU 0	iGPU Radeon RX Vega M GH
Shaders -	Shaders 1536
Boost Clock -	Boost Clock 1.19GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 3.66 TFLOPSFP16

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Cannon Lake	Architecture Skylake
Family Core 8th Gen	Family Core 8th Gen
Branding	Branding
Codename Cannon Lake - Palm CoveP-Core	Codename Kaby Lake-G Kaby Lake-4C-GT2Variant -
Market Segment Laptop	Market Segment Laptop
Release Date May 5, 2018	Release Date Jan 7, 2018

Fabrication

Foundry Intel	Foundry Intel
Other Foundries - - IntelPCH	Other Foundries SK HynixHBM2 GlobalFoundriesiGPU -
Fabrication Node 10nm - - 14nmPCH	Fabrication Node 14nm++ 21nmHBM2 14nmiGPU -
Die Size 71mm² - - 46mm²PCH	Die Size 125mm² 92mm²HBM2 208mm²iGPU -
Transistor Count 3.1 Billion -	Transistor Count 2.1 Billion 5 BillioniGPU
Transistor Density 44 MTr/mm² -	Transistor Density 17 MTr/mm² 24 MTr/mm²iGPU

Images

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Competitors

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IntelCore i7-8709G vs CPU AMDRyzen 3 210 IntelCore i7-8709G vs CPU AMDRyzen 3 PRO 210 IntelCore i7-8709G vs CPU AMDRyzen 5 240 Show 12 more