Intel Core i5-13450HX vs AMD Ryzen AI Max 385 Full Specs

Summary

10 Cores(6P+4E) 16 Threads(12P+4E) 2.4GHz	8 Cores 16 Threads 3.6GHz
TDP 55W	TDP 65W
Bandwidth 76.8GB/s DDR5·DDR4	Bandwidth 256GB/s LPDDR5X
iGPU UHD 16EU 1450MHz Gen 12	iGPU Radeon 8050S
Peak·FP32·FP16 742.4 GFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16
Socket BGA 1964	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i5-13450HX2,242

x1

Ryzen AI Max 385-

-

Show Top Score

Core Config

10 Cores 6P 4E	8 Cores 8P -
16 Threads 12P 4E	16 Threads 16P -

Clocks

Base Clock 2.4GHz	Base Clock 3.6GHz
Boost Clock 4.5GHz	Boost Clock 5GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 48KB P -
L2 2MB P 4MB E shared	L2 1MB P -
L3 24MB	L3 32MB

Memory

Type DDR5·DDR4	Type LPDDR5X
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 4800MT/s	Speed 8000MT/s
Bandwidth 76.8GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate4800MT/s Calculated Bandwidth 76.8GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 55W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Peak Power 157W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 8 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 16GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU UHD 16EU 1450MHz Gen 12	iGPU Radeon 8050S
Shaders 128	Shaders 2048
Boost Clock 1.45GHz	Boost Clock 2.8GHz
Peak·FP32·FP16 742.4 GFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance -	Performance 50 TOPSINT8

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Raptor Lake	Architecture Zen 5
Family Core 13th Gen	Family Ryzen AI 300
Branding	Branding
Codename Raptor Lake-HX - Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core	Codename Strix Halo EldoraDie - Zen 5P-Core -
Market Segment Laptop	Market Segment Laptop
Release Date Jan 1, 2023	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node Intel 7 -	Fabrication Node N4X N5SoC
Die Size 257mm²	Die Size 71mm²
Transistor Count 18.5 Billion	Transistor Count 8.3 Billion
Transistor Density 72 MTr/mm²	Transistor Density 118 MTr/mm²

Images

No images available

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Used In

Laptops G15(5530, Early 2023)	Laptops -
Desktops -	Desktops Framework Desktop(Early 2025)

Competitors

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