Intel Core i7-10850H vs AMD Ryzen AI Max 385 Full Specs

Summary

6 Cores 12 Threads 2.7GHz	8 Cores 16 Threads 3.6GHz
TDP 45W	TDP 65W
Bandwidth 46.9GB/s DDR4	Bandwidth 256GB/s LPDDR5X
iGPU UHD 630 1150MHz	iGPU Radeon 8050S
Peak·FP32·FP16 441.6 GFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16
Socket BGA 1440	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i7-10850H1,440

x1

Ryzen AI Max 385-

-

Show Top Score

Core Config

6 Cores	8 Cores
12 Threads	16 Threads

Clocks

Base Clock 2.7GHz	Base Clock 3.6GHz
Boost Clock 5.1GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB	L1i 32KB
L1d 32KB	L1d 48KB
L2 256KB	L2 1MB
L3 12MB	L3 32MB

Memory

Type DDR4	Type LPDDR5X
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 2933MT/s	Speed 8000MT/s
Bandwidth 46.9GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate2933MT/s Calculated Bandwidth 46.9GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 45W	TDP 65W
cTDP-down 35W	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 4 lanes	Bus Config 4 lanes
Bus Speed 8GT/s	Bus Speed 16GT/s
Bus Bandwidth 4GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 3.0 x16 15.8GB/sBandwidth

PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU UHD 630 1150MHz	iGPU Radeon 8050S
Shaders 192	Shaders 2048
Boost Clock 1.15GHz	Boost Clock 2.8GHz
Peak·FP32·FP16 441.6 GFLOPSFP16	Peak·FP32·FP16 22.94 TFLOPSFP16

NPU

NPU Model -	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance -	Performance 50 TOPSINT8

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Skylake	Architecture Zen 5
Family Core 10th Gen	Family Ryzen AI 300
Branding	Branding
Codename Comet Lake-H - Comet Lake-6CVariant -	Codename Strix Halo EldoraDie - Zen 5P-Core
Market Segment Laptop	Market Segment Laptop
Release Date Apr 2, 2020	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node 14nm+++ -	Fabrication Node N4X N5SoC
Die Size 150mm²	Die Size 71mm²
Transistor Count 2.5 Billion	Transistor Count 8.3 Billion
Transistor Density 17 MTr/mm²	Transistor Density 118 MTr/mm²

Images

No images available

No images available

Used In

Desktops -

Desktops Framework Desktop(Early 2025)

Competitors

IntelCore i7-10850H vs CPU AMDRyzen AI Max PRO 380 IntelCore i7-10850H vs CPU AMDRyzen AI 5 PRO 340 IntelCore i7-10850H vs CPU AMDRyzen AI 5 340 Show 12 more

AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 385 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max 385 vs CPU AMDRyzen AI Max 390 Show 12 more