Intel Core i7-12650HX vs AMD Ryzen AI Max+ 395 Full Specs

Summary

14 Cores(6P+8E) 20 Threads(12P+8E) 2GHz	16 Cores 32 Threads 3GHz
TDP 55W	TDP 65W
Bandwidth 76.8GB/s DDR5·DDR4	Bandwidth 256GB/s LPDDR5X
iGPU UHD 32EU 1450MHz Gen 12	iGPU Radeon 8060S
Peak·FP32·FP16 1.49 TFLOPSFP16	Peak·FP32·FP16 29.7 TFLOPSFP16
Socket BGA 1964	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i7-12650HX2,300

x1

Ryzen AI Max+ 3952,984

x1.30

Show Top Score

Core Config

14 Cores 6P 8E	16 Cores 16P -
20 Threads 12P 8E	32 Threads 32P -

Clocks

Base Clock 2GHz	Base Clock 3GHz
Boost Clock 4.7GHz	Boost Clock 5.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 32KB P -
L1d 48KB P 32KB E	L1d 48KB P -
L2 1.25MB P 2MB E shared	L2 1MB P -
L3 24MB	L3 64MB

Memory

Type DDR5·DDR4	Type LPDDR5X
Max Memory 128GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 4
Bus Width 128-bit	Bus Width 256-bit
Speed 4800MT/s	Speed 8000MT/s
Bandwidth 76.8GB/s	Bandwidth 256GB/s
Bandwidth Calculator Channels Transfer Rate4800MT/s Calculated Bandwidth 76.8GB/s	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 55W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Peak Power 157W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type DMI	Bus Type PCIe
Bus Config 8 lanes	Bus Config 4 lanes
Bus Speed 16GT/s	Bus Speed 16GT/s
Bus Bandwidth 16GB/s	Bus Bandwidth 8GB/s

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU UHD 32EU 1450MHz Gen 12	iGPU Radeon 8060S
Shaders 256	Shaders 2560
Boost Clock 1.45GHz	Boost Clock 2.9GHz
Peak·FP32·FP16 1.49 TFLOPSFP16	Peak·FP32·FP16 29.7 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance -	Performance 50 TOPSINT8

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Alder Lake	Architecture Zen 5
Family Core 12th Gen	Family Ryzen AI 300
Branding	Branding
Codename Alder Lake-HX - Alder Lake-8P-8EVariant Golden CoveP-Core GracemontE-Core	Codename Strix Halo EldoraDie - Zen 5P-Core -
Market Segment Laptop	Market Segment Laptop
Release Date May 10, 2022	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node Intel 7 -	Fabrication Node N4X N5SoC
Die Size 202mm²	Die Size 141mm²
Transistor Count 14.6 Billion	Transistor Count 16.6 Billion
Transistor Density 72 MTr/mm²	Transistor Density 118 MTr/mm²

Images

No images available

No images available

Used In

Desktops -

Desktops Framework Desktop(Early 2025)

Competitors

IntelCore i7-12650HX vs CPU IntelCore Ultra 5 235HX IntelCore i7-12650HX vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) IntelCore i7-12650HX vs CPU AMDRyzen AI Max 390 Show 12 more

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 385 Show 12 more