CPUs

Intel Core i7-12700TE vs Intel Core Ultra 5 225H Full Specs

12 Cores(8P+4E)
20 Threads(16P+4E)
1.4GHz
14 Cores(4P+8M+2E)
14 Threads(4P+8M+2E)
1.7GHz
TDP
35W
TDP
28W
Bandwidth
76.8GB/s
·
Bandwidth
134.4GB/s
·
iGPU
iGPU
··
1.54 TFLOPSFP16
··
7.88 TFLOPSFP16
Socket
Socket

Core i7-12700TECore i7-12700TE2,006
x1
Core Ultra 5 225HCore Ultra 5 225H2,697
x1.34

12 Cores
8P
-
4E
14 Cores
4P
8M
2E
20 Threads
16P
-
4E
14 Threads
4P
8M
2E

Base Clock
1.4GHz
Base Clock
1.7GHz
Boost Clock
4.6GHz
Boost Clock
4.9GHz
Overclocking
Locked
Overclocking
Locked

L1i
32KB P
-
64KB E
L1i
64KB P
64KB M
64KB E
L1d
48KB P
-
32KB E
L1d
48KB P
32KB M
32KB E
L2
1.25MB P
-
2MB E shared
L2
3MB P
8MB M shared
2MB E shared
L3
25MB
L3
18MB

Type
·
Type
·
Max Memory
128GB
Max Memory
128GB
ECC
Yes
ECC
No
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
4800MT/s
Speed
8400MT/s
Bandwidth
76.8GB/s
Bandwidth
134.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
76.8GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
134.4GB/s

TDP
35W
TDP
28W
cTDP-down
-
cTDP-down
20W
Peak Power
-
Peak Power
115W
Max Operating Temp
100°C Max
Max Operating Temp
110°C Max
Included Cooler
0
Included Cooler
-

Bus Type
DMI
Bus Type
-
Bus Config
8 lanes
Bus Config
-
Bus Speed
16GT/s
Bus Speed
-
Bus Bandwidth
16GB/s
Bus Bandwidth
-

PCIe
PCIe 5.0 x16
63GB/sBandwidth
PCIe
PCIe 5.0 x8
31.5GB/sBandwidth
PCIe Secondary
PCIe 4.0 x4
7.9GB/sBandwidth
PCIe Secondary
PCIe 4.0 x20
39.4GB/sBandwidth

iGPU
iGPU
Shaders
256
Shaders
896
Boost Clock
1.5GHz
Boost Clock
2.2GHz
··
1.54 TFLOPSFP16
··
7.88 TFLOPSFP16

NPU Model
GNA 3.0
NPU Model
AI Boost 3
NPU Cores
-
NPU Cores
2
Performance
-
Performance
13 TOPSINT8

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core i7 2020 branding
Branding
Core Ultra 5 2023 branding
Codename
Alder Lake-HX
Alder Lake-8P-8EVariant
Golden CoveP-Core
-
GracemontE-Core
Codename
Arrow Lake-H
Arrow Lake-H-4P-8EVariant
Lion CoveP-Core
SkymontM-Core
CrestmontE-Core
Market Segment
Embedded
Market Segment
Laptop
Release Date
Jan 18, 2022
Release Date
Jan 6, 2025

Foundry
Intel
Foundry
TSMC
Other Foundries
-
Other Foundries
TSMCiGPU
TSMCIO
TSMCSoC
Fabrication Node
Intel 7
-
-
-
Fabrication Node
N3B
N5iGPU
N6IO
N6SoC
Die Size
202mm²
-
-
-
Die Size
-
44mm²iGPU
28mm²IO
100mm²SoC
Transistor Count
14.6 Billion
Transistor Count
-
Transistor Density
72 MTr/mm²
Transistor Density
-

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