Intel Core i7-13700HX vs Apple M5 (10C8G-FL) Full Specs

Summary

16 Cores(8P+8E) 24 Threads(16P+8E) 2.1GHz	10 Cores(4P+6E) 10 Threads(4P+6E) 4.46GHz
TDP 55W	TDP 15W
Bandwidth 76.8GB/s DDR5·DDR4	Bandwidth 153.6GB/s LPDDR5X
iGPU UHD 32EU 1550MHz Gen 12	iGPU 8-Core M5-FL
Peak·FP32·FP16 1.59 TFLOPSFP16	Peak·FP32·FP16 25.85 TOPSINT8 Tensor
Socket BGA 1964	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i7-13700HX2,550

x1.24

M5 (10C8G-FL)2,060

x1

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Core Config

16 Cores 8P 8E	10 Cores 4P 6E
24 Threads 16P 8E	10 Threads 4P 6E

Clocks

Base Clock 2.1GHz	Base Clock 4.46GHz
Boost Clock 5GHz	Boost Clock -
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 192KB P 128KB E
L1d 48KB P 32KB E	L1d 128KB P 64KB E
L2 2MB P - 8MB E shared	L2 1MB P 16MB P shared 6MB E shared
L3 30MB	L3 -
SLC Cache -	SLC Cache 8MB

Memory

Type DDR5·DDR4	Type LPDDR5X
Max Memory 128GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 4800MT/s	Speed 9600MT/s
Bandwidth 76.8GB/s	Bandwidth 153.6GB/s
Bandwidth Calculator Channels Transfer Rate4800MT/s UC·Spec·OC 76.8GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s UC·Spec·OC 153.6GB/s

Power & Thermals

TDP 55W	TDP 15W
Peak Power 157W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 4.0 x5 9.8GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU UHD 32EU 1550MHz Gen 12	iGPU 8-Core M5-FL
Shaders 256	Shaders 1024
Boost Clock 1.55GHz	Boost Clock 1.58GHz
Peak·FP32·FP16 1.59 TFLOPSFP16	Peak·FP32·FP16 25.85 TOPSINT8 Tensor

NPU

NPU Model GNA 3.0	NPU Model H17 Theia
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.45GHz
Performance -	Performance 38 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture Apple Silicon 15ARMv9.2-A
Family Core 13th Gen	Family M Series
Branding	Branding
Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core	Codename Hidra M5Variant AS15PP-Core AS15EE-Core
Market Segment Laptop	Market Segment Tablet
Release Date Jan 1, 2023	Release Date Mar 3, 2026

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 7	Fabrication Node N3P
Die Size 257mm²	Die Size -
Transistor Count 18.5B	Transistor Count -
Transistor Density 72 MTr/mm²	Transistor Density -

Images