Intel Core i7-3687U vs Apple M5 (10C8G-FL) Full Specs

Summary

2 Cores 4 Threads 2.1GHz	10 Cores(4P+6E) 10 Threads(4P+6E) 4.46GHz
TDP 17W	TDP 15W
Bandwidth 25.6GB/s DDR3·DDR3L	Bandwidth 153.6GB/s LPDDR5X
iGPU HD 4000 1200MHz	iGPU 8-Core M5-FL
Peak·FP32·FP16 307.2 GFLOPSFP32	Peak·FP32·FP16 6.46 TFLOPSFP16
Socket BGA 1023	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i7-3687U541

x1

M5 (10C8G-FL)4,175

x7.72

Show Top Score

Core Config

2 Cores 2P -	10 Cores 4P 6E
4 Threads 4P -	10 Threads 4P 6E

Clocks

Base Clock 2.1GHz	Base Clock 4.46GHz
Boost Clock 3.3GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 256KB P - -	L2 1MB P 16MB P shared 6MB E shared
L3 4MB	L3 -
SLC Cache -	SLC Cache 8MB

Memory

Type DDR3·DDR3L	Type LPDDR5X
Max Memory 32GB	Max Memory 32GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 1600MT/s	Speed 9600MT/s
Bandwidth 25.6GB/s	Bandwidth 153.6GB/s
Bandwidth Calculator Channels Transfer Rate1600MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 153.6GB/s

Power & Thermals

TDP 17W	TDP 15W
Max Operating Temp 105°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 4 lanes	Bus Config -
Bus Speed 5GT/s	Bus Speed -
Bus Bandwidth 2.5GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 2.0 x16 8GB/sBandwidth

PCIe PCIe 4.0 x5 9.8GB/sBandwidth

iGPU

iGPU HD 4000 1200MHz	iGPU 8-Core M5-FL
Shaders 128	Shaders 1024
Boost Clock 1.2GHz	Boost Clock 1.58GHz
Peak·FP32·FP16 307.2 GFLOPSFP32	Peak·FP32·FP16 6.46 TFLOPSFP16

NPU

NPU Model -	NPU Model H17 Theia
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.45GHz
Performance -	Performance 38 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Ivy Bridge	Architecture Apple Silicon 15ARMv9.2-A
Family Core 3rd Gen	Family M Series
Branding	Branding
Codename Ivy Bridge Ivy Bridge-H-2Die Ivy Bridge-2C-GT2Variant - -	Codename Hidra - M5Variant AS15PP-Core AS15EE-Core
Market Segment Laptop	Market Segment Tablet
Release Date Jan 1, 2013	Release Date Mar 3, 2026

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 22nm	Fabrication Node N3P
Die Size 118mm²	Die Size -
Transistor Count 945 Million	Transistor Count -
Transistor Density 8 MTr/mm²	Transistor Density -

Images

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Used In

Laptops -

Laptops MacBook Air 13(M5, Early 2026)

Competitors

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