Intel Core i9-13950HX vs Apple M3 Max (14C30G) Full Specs

Summary

24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz	14 Cores(10P+4E) 14 Threads(10P+4E) 4.05GHz
TDP 55W	TDP 140W
Bandwidth 89.6GB/s DDR5·DDR4	Bandwidth 307.2GB/s LPDDR5
iGPU UHD 32EU 1650MHz Gen 12	iGPU 30-Core M3 Max
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 10.6 TFLOPSFP16
Socket BGA 1964	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i9-13950HX2,680

x1

M3 Max (14C30G)3,182

x1.19

Show Top Score

Core Config

24 Cores 8P 16E	14 Cores 10P 4E
32 Threads 16P 16E	14 Threads 10P 4E

Clocks

Base Clock 2.2GHz	Base Clock 4.05GHz
Boost Clock 5.5GHz	Boost Clock -
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 192KB P 128KB E
L1d 48KB P 32KB E	L1d 128KB P 64KB E
L2 2MB P - 16MB E shared	L2 32MB P shared 4MB E shared
L3 36MB	L3 -
SLC Cache -	SLC Cache 48MB

Memory

Type DDR5·DDR4	Type LPDDR5
Max Memory 128GB	Max Memory 96GB
ECC No	ECC No
Channels 2	Channels 3
Bus Width 128-bit	Bus Width 384-bit
Speed 5600MT/s	Speed 6400MT/s
Bandwidth 89.6GB/s	Bandwidth 307.2GB/s
Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 307.2GB/s

Power & Thermals

TDP 55W	TDP 140W
Peak Power 157W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU UHD 32EU 1650MHz Gen 12	iGPU 30-Core M3 Max
Shaders 256	Shaders 3840
Boost Clock 1.65GHz	Boost Clock 1.38GHz
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 10.6 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model H15 Erebus
NPU Cores -	NPU Cores 16
NPU Clock -	NPU Clock 2.36GHz
Performance -	Performance 18 TOPSFP16

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture Apple Silicon 13ARMv8.6-A
Family Core 13th Gen	Family M Series
Branding	Branding
Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core	Codename Palma-M M3 MaxVariant EverestP-Core Sawtooth E-Core
Market Segment Laptop	Market Segment Desktop
Release Date Jan 1, 2023	Release Date Oct 30, 2023

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 7	Fabrication Node N3B
Die Size 257mm²	Die Size 477mm²
Transistor Count 18.5 Billion	Transistor Count 92 Billion
Transistor Density 72 MTr/mm²	Transistor Density 193 MTr/mm²

Images

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Used In

Laptops Blade 16(Early 2023)

Laptops MacBook Pro 16(M3 Max, Late 2023)MacBook Pro 14(M3 Max, Late 2023)

Competitors

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