Intel Core i9-14900HX vs Qualcomm Snapdragon X2 Elite (X2E-88-100) Full Specs

Summary

24 Cores(8P+16E) 32 Threads(16P+16E) 2.2GHz	18 Cores(12P+6E) 18 Threads(12P+6E) 4GHz
TDP 55W	TDP 80W
Bandwidth 89.6GB/s DDR5·DDR4	Bandwidth 152.4GB/s LPDDR5X
iGPU UHD 32EU 1650MHz Gen 12	iGPU Adreno X2-90 7T
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 13.93 TFLOPSFP16
Socket BGA 1964	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core i9-14900HX2,950

x1

Snapdragon X2 Elite (X2E-88-100)-

-

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Core Config

24 Cores 8P 16E	18 Cores 12P 6E
32 Threads 16P 16E	18 Threads 12P 6E

Clocks

Base Clock 2.2GHz	Base Clock 4GHz
Boost Clock 5.8GHz	Boost Clock 4.7GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 32KB P 64KB E	L1i 192KB P 128KB E
L1d 48KB P 32KB E	L1d 96KB P 64KB E
L2 2MB P - 16MB E shared	L2 36MB P shared 12MB E shared
L3 36MB	L3 -

Memory

Type DDR5·DDR4	Type LPDDR5X
Max Memory 192GB	Max Memory 128GB
ECC No	ECC No
Channels 2	Channels 8
Bus Width 128-bit	Bus Width 128-bit
Speed 5600MT/s	Speed 9523MT/s
Bandwidth 89.6GB/s	Bandwidth 152.4GB/s
Bandwidth Calculator Channels Transfer Rate5600MT/s Calculated Bandwidth 89.6GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 152.4GB/s

Power & Thermals

TDP 55W	TDP 80W
cTDP-down 45W	cTDP-down -
Peak Power 157W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x16 63GB/sBandwidth	PCIe PCIe 5.0 x12 47.3GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU UHD 32EU 1650MHz Gen 12	iGPU Adreno X2-90 7T
Shaders 256	Shaders 2048
Boost Clock 1.65GHz	Boost Clock 1.7GHz
Peak·FP32·FP16 1.69 TFLOPSFP16	Peak·FP32·FP16 13.93 TFLOPSFP16

NPU

NPU Model GNA 3.0	NPU Model Hexagon
Performance -	Performance 80 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Raptor Lake	Architecture Oryon 3ARMv8.7-A
Family Core 14th Gen	Family X Series
Branding	Branding
Codename Raptor Lake-HX Raptor Lake-8P-16EVariant Raptor CoveP-Core GracemontE-Core	Codename Glymur - Pegasus-PP-Core Pegasus-EE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 8, 2024	Release Date Sep 24, 2025

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node Intel 7	Fabrication Node N3E
Die Size 257mm²	Die Size 288mm²
Transistor Count 18.5 Billion	Transistor Count -
Transistor Density 72 MTr/mm²	Transistor Density -

Images

No images available

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Used In

Laptops Blade 18(Early 2024)Alienware m18(R2, Early 2024)Blade 16(Early 2024)

Laptops -

Competitors

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QualcommSnapdragon X2 Elite (X2E-88-100) vs CPU QualcommSnapdragon X2 Elite Extreme (X2E-96-100) QualcommSnapdragon X2 Elite (X2E-88-100) vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) QualcommSnapdragon X2 Elite (X2E-88-100) vs CPU AMDRyzen AI Max+ 395 Show 12 more