CPUs

Intel Core Ultra 5 225H vs Intel Core Ultra 9 285HX Full Specs

14 Cores(4P+8M+2E)
14 Threads(4P+8M+2E)
1.7GHz
24 Cores(8P+16E)
24 Threads(8P+16E)
2.8GHz
TDP
28W
TDP
55W
Bandwidth
134.4GB/s
·
Bandwidth
102.4GB/s
DDR5
iGPU
iGPU
··
7.88 TFLOPSFP16
··
4.1 TFLOPSFP16
Socket
Socket

Core Ultra 5 225HCore Ultra 5 225H2,697
x1
Core Ultra 9 285HXCore Ultra 9 285HX-
-

14 Cores
4P
8M
2E
24 Cores
8P
-
16E
14 Threads
4P
8M
2E
24 Threads
8P
-
16E

Base Clock
1.7GHz
Base Clock
2.8GHz
Boost Clock
4.9GHz
Boost Clock
5.5GHz
Overclocking
Locked
Overclocking
Unlocked

L1i
64KB P
64KB M
64KB E
L1i
64KB P
-
64KB E
L1d
48KB P
32KB M
32KB E
L1d
48KB P
-
32KB E
L2
3MB P
8MB M shared
2MB E shared
L2
3MB P
-
16MB E shared
L3
18MB
L3
30MB

Type
·
Type
DDR5
Max Memory
128GB
Max Memory
192GB
ECC
No
ECC
Yes
Channels
2
Channels
2
Bus Width
128-bit
Bus Width
128-bit
Speed
8400MT/s
Speed
6400MT/s
Bandwidth
134.4GB/s
Bandwidth
102.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
134.4GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
102.4GB/s

TDP
28W
TDP
55W
cTDP-down
20W
cTDP-down
45W
Peak Power
115W
Peak Power
160W
Max Operating Temp
110°C Max
Max Operating Temp
105°C Max

Bus Type
-
Bus Type
DMI
Bus Config
-
Bus Config
8 lanes
Bus Speed
-
Bus Speed
16GT/s
Bus Bandwidth
-
Bus Bandwidth
16GB/s

PCIe
PCIe 5.0 x8
31.5GB/sBandwidth
PCIe
PCIe 5.0 x20
78.8GB/sBandwidth
PCIe Secondary
PCIe 4.0 x20
39.4GB/sBandwidth
PCIe Secondary
PCIe 4.0 x4
7.9GB/sBandwidth

iGPU
iGPU
Shaders
896
Shaders
512
Boost Clock
2.2GHz
Boost Clock
2GHz
··
7.88 TFLOPSFP16
··
4.1 TFLOPSFP16

NPU Model
AI Boost 3
NPU Model
AI Boost 3
NPU Cores
2
NPU Cores
2
Performance
13 TOPSINT8
Performance
13 TOPSINT8

Manufacturer
Manufacturer
ISA
x86-64
ISA
x86-64
Architecture
Architecture
Family
Family
Branding
Core Ultra 5 2023 branding
Branding
Core Ultra 9 2023 branding
Codename
Arrow Lake-H
Arrow Lake-H-4P-8EVariant
Lion CoveP-Core
SkymontM-Core
CrestmontE-Core
Codename
Arrow Lake-S
Arrow Lake-S-8P-16EVariant
Lion CoveP-Core
-
SkymontE-Core
Market Segment
Laptop
Market Segment
Laptop
Release Date
Jan 6, 2025
Release Date
Jan 6, 2025

Foundry
TSMC
Foundry
TSMC
Other Foundries
TSMCiGPU
TSMCIO
TSMCSoC
Other Foundries
TSMCiGPU
TSMCIO
TSMCSoC
Fabrication Node
N3B
N5iGPU
N6IO
N6SoC
Fabrication Node
N3B
N5iGPU
N6IO
N6SoC
Die Size
-
44mm²iGPU
28mm²IO
100mm²SoC
Die Size
135mm²
23mm²iGPU
28mm²IO
100mm²SoC

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