Intel Core Ultra 5 226V vs AMD Ryzen 5 7530U Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 4.5GHz	6 Cores 12 Threads 2GHz
TDP 17W	TDP 15W
Bandwidth 136.5GB/s LPDDR5X	Bandwidth 68.3GB/s LPDDR4X·DDR4
iGPU Arc 130V 1850MHz	iGPU Radeon 7CU 2000MHz RDNA 2
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 3.58 TFLOPSFP16
Socket BGA 2833	Socket FP6

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 5 226V2,207

x1.35

Ryzen 5 7530U1,629

x1

Show Top Score

Core Config

8 Cores 4P 4E	6 Cores 6P -
8 Threads 4P 4E	12 Threads 12P -

Clocks

Base Clock 4.5GHz	Base Clock 2GHz
Boost Clock -	Boost Clock 4.5GHz
Overclocking Locked	Overclocking Locked

Cache

L0i 64KB	L0i -
L0d 48KB	L0d -
L1i - 64KB E	L1i 32KB P -
L1d 192KB P 32KB E	L1d 32KB P -
L2 2.5MB P 4MB E shared	L2 512KB P -
L3 8MB	L3 16MB

Memory

Type LPDDR5X	Type LPDDR4X·DDR4
Max Memory 16GB	Max Memory 16GB
ECC No	ECC Yes
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 128-bit
Speed 8533MT/s	Speed 4266MT/s
Bandwidth 136.5GB/s	Bandwidth 68.3GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 136.5GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 68.3GB/s

Power & Thermals

TDP 17W	TDP 15W
cTDP-down 8W	cTDP-down -
Peak Power 37W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp 95°C Max

Chipset Bus

Bus Type -	Bus Type PCIe
Bus Config -	Bus Config 4 lanes
Bus Speed -	Bus Speed 8GT/s
Bus Bandwidth -	Bus Bandwidth 4GB/s

Expansion

PCIe PCIe 5.0 x4 15.8GB/sBandwidth	PCIe PCIe 3.0 x16 15.8GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Arc 130V 1850MHz	iGPU Radeon 7CU 2000MHz RDNA 2
Shaders 896	Shaders 448
Boost Clock 1.85GHz	Boost Clock 2GHz
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 3.58 TFLOPSFP16

NPU

NPU Model AI Boost 4	NPU Model -
NPU Cores 5	NPU Cores -
Performance 40 TOPSINT8	Performance -

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture Lunar Lake	Architecture Zen 3
Family Core Ultra Series 2	Family Ryzen 7000
Branding	Branding
Codename Lunar Lake-V Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core	Codename Barcelo-R - - -
Market Segment Laptop	Market Segment Laptop
Release Date Sep 3, 2024	Release Date Jan 1, 2023

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries IntelFIB TSMCIO	Other Foundries -
Fabrication Node N3B 22nmFIB N6IO	Fabrication Node N7 - -
Die Size 140mm² 46mm²IO	Die Size 180mm² -
Transistor Count -	Transistor Count 10.7B
Transistor Density -	Transistor Density 59 MTr/mm²

Images