Intel Core Ultra 5 226V vs Intel Core 2 Duo P7350 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2.1GHz	2 Cores 2 Threads 2GHz
TDP 17W	TDP 25W
Bandwidth 136.5GB/s LPDDR5X	Bandwidth -
iGPU Arc 130V 1850MHz	iGPU -
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 -
Socket BGA 2833	Socket Socket P

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 5 226V2,543

x10.01

Core 2 Duo P7350254

x1

Show Top Score

Core Config

8 Cores 4P 4E	2 Cores 2P -
8 Threads 4P 4E	2 Threads 2P -

Clocks

Base Clock 2.1GHz	Base Clock 2GHz
Boost Clock 4.5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L0i 64KB	L0i -
L0d 48KB	L0d -
L1i - 64KB E	L1i 32KB P -
L1d 192KB P 32KB E	L1d 32KB P -
L2 2.5MB P - 4MB E shared	L2 3MB P shared -
L3 8MB	L3 -

Memory

Type LPDDR5X	Type -
Max Memory 16GB	Max Memory -
ECC No	ECC -
Channels 2	Channels -
Bus Width 128-bit	Bus Width -
Speed 8533MT/s	Speed -
Bandwidth 136.5GB/s	Bandwidth -
Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 136.5GB/s	Bandwidth Calculator -

Power & Thermals

TDP 17W	TDP 25W
cTDP-down 8W	cTDP-down -
Peak Power 37W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -
Voltage Range -	Voltage Range -

Chipset Bus

Bus Type -	Bus Type FSB
Bus Config -	Bus Config 64-bit
Bus Speed -	Bus Speed 1.066GT/s
Bus Bandwidth -	Bus Bandwidth 8.5GB/s

Expansion

PCIe PCIe 5.0 x4 15.8GB/sBandwidth	-
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Arc 130V 1850MHz	iGPU -
Shaders 896	Shaders -
Boost Clock 1.85GHz	Boost Clock -
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 -

NPU

NPU Model AI Boost 4	NPU Model -
NPU Cores 5	NPU Cores -
Performance 40 TOPSINT8	Performance -

Chip

Manufacturer Intel	Manufacturer Intel
ISA x86-64	ISA x86-64
Architecture Lunar Lake	Architecture Penryn
Family Core Ultra Series 2	Family Core 2
Branding	Branding
Codename Lunar Lake-V Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core	Codename Penryn-3M - - -
Market Segment Laptop	Market Segment Laptop
Release Date Sep 3, 2024	Release Date Jul 15, 2008
Part Number QQ8076606107, QQ8076606108	Part Number AW80576GH0413M, AW80577SH0413M
S-Spec SRPMQ, SRPMR	S-Spec SLB44 (C0), SLB53 (M0)
Official specs

Fabrication

Foundry TSMC	Foundry Intel
Other Foundries IntelFIB TSMCIO	Other Foundries -
Fabrication Node N3B 22nmFIB N6IO	Fabrication Node 45nm - -
Die Size 140mm² 46mm²IO	Die Size 82mm² -
Transistor Count -	Transistor Count 228M
Transistor Density -	Transistor Density 3 MTr/mm²

Images