Intel Core Ultra 5 226V vs Qualcomm Snapdragon 7c Gen 2 Full Specs

Summary

8 Cores(4P+4E) 8 Threads(4P+4E) 2.1GHz	8 Cores(2P+6E) 8 Threads(2P+6E) 2.55GHz
TDP 17W	TDP -
Bandwidth 136.5GB/s LPDDR5X	Bandwidth 17.1GB/s LPDDR4X
iGPU Arc 130V 1850MHz	iGPU Adreno 618
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 844.8 GFLOPSFP16
Socket BGA 2833	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 5 226V2,543

x1

Snapdragon 7c Gen 2-

-

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Core Config

8 Cores 4P 4E	8 Cores 2P 6E
8 Threads 4P 4E	8 Threads 2P 6E

Clocks

Base Clock 2.1GHz	Base Clock 2.55GHz
Boost Clock 4.5GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L0i 64KB	L0i -
L0d 48KB	L0d -
L1i - 64KB E	L1i 64KB P 32KB E
L1d 192KB P 32KB E	L1d 64KB P 32KB E
L2 2.5MB P - 4MB E shared	L2 512KB P 128KB E -
L3 8MB	L3 -
SLC Cache -	SLC Cache 1MB

Memory

Type LPDDR5X	Type LPDDR4X
Max Memory 16GB	Max Memory 16GB
ECC No	ECC No
Channels 2	Channels 2
Bus Width 128-bit	Bus Width 32-bit
Speed 8533MT/s	Speed 4266MT/s
Bandwidth 136.5GB/s	Bandwidth 17.1GB/s
Bandwidth Calculator Channels Transfer Rate8533MT/s UC·Spec·OC 136.5GB/s	Bandwidth Calculator Channels Transfer Rate4266MT/s UC·Spec·OC 17.1GB/s

Power & Thermals

TDP 17W	TDP -
cTDP-down 8W	cTDP-down -
Peak Power 37W	Peak Power -
Max Operating Temp 100°C Max	Max Operating Temp -

Expansion

PCIe PCIe 5.0 x4 15.8GB/sBandwidth	-
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Arc 130V 1850MHz	iGPU Adreno 618
Shaders 896	Shaders 256
Boost Clock 1.85GHz	Boost Clock 825MHz
Peak·FP32·FP16 106.1 TOPSINT4 Tensor	Peak·FP32·FP16 844.8 GFLOPSFP16

NPU

NPU Model AI Boost 4	NPU Model Hexagon 692
NPU Cores 5	NPU Cores -
Performance 40 TOPSINT8	Performance 5 TOPS

Cellular

Modem Model -	Modem Model X15
Peak Down -	Peak Down Up to 800Mbps
Peak Up -	Peak Up Up to 150Mbps

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Lunar Lake	Architecture Kryo 468ARMv8.2-A
Family Core Ultra Series 2	Family 7 Series
Branding	Branding
Codename Lunar Lake-V Lunar Lake-MXVariant Lion CoveP-Core SkymontE-Core	Codename - - Cortex-A76P-Core Cortex-A55E-Core
Market Segment Laptop	Market Segment Laptop
Release Date Sep 3, 2024	Release Date May 19, 2021
Part Number QQ8076606107, QQ8076606108	Part Number SC7180P
S-Spec SRPMQ, SRPMR	S-Spec -
Official specs

Fabrication

Foundry TSMC	Foundry Samsung
Other Foundries IntelFIB TSMCIO	Other Foundries -
Fabrication Node N3B 22nmFIB N6IO	Fabrication Node 8LPP - -
Die Size 140mm² 46mm²IO	Die Size -

Images