Intel Core Ultra 5 325 vs Qualcomm Snapdragon 7c Gen 2 Full Specs
8 Cores(4P+4E) 8 Threads(4P+4E) 2.1GHz | 8 Cores(2P+6E) 8 Threads(2P+6E) 2.55GHz |
TDP 25W | TDP - |
Bandwidth 119.5GB/s · | Bandwidth 17.1GB/s LPDDR4X |
iGPU | iGPU |
·· 80.28 TFLOPSFP16 | ·· 844.8 GFLOPSFP16 |
Socket | Socket - |
Core Ultra 5 3253.4GHz
Snapdragon 7c Gen 2-8 Cores 4P 4E | 8 Cores 2P 6E |
8 Threads 4P 4E | 8 Threads 2P 6E |
Base Clock 2.1GHz | Base Clock 2.55GHz |
Boost Clock 4.5GHz | Boost Clock - |
Overclocking Locked | Overclocking Locked |
L0i 64KB | L0i - |
L0d 48KB | L0d - |
L1i - 64KB E | L1i 64KB P 32KB E |
L1d 192KB P 32KB E | L1d 64KB P 32KB E |
L2 3MB P - 4MB E shared | L2 512KB P 128KB E - |
L3 12MB | L3 - |
SLC Cache - | SLC Cache 1MB |
Type · | Type LPDDR4X |
Max Memory 96GB | Max Memory 16GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 32-bit |
Speed 7466MT/s | Speed 4266MT/s |
Bandwidth 119.5GB/s | Bandwidth 17.1GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 119.5GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 17.1GB/s |
TDP 25W | TDP - |
cTDP-down 12W | cTDP-down - |
Peak Power 55W | Peak Power - |
Max Operating Temp 100°C Max | Max Operating Temp - |
PCIe PCIe 5.0 x415.8GB/sBandwidth | - |
PCIe Secondary PCIe 4.0 x815.8GB/sBandwidth | - |
iGPU | iGPU |
Shaders 512 | Shaders 256 |
Boost Clock 2.45GHz | Boost Clock 825MHz |
·· 80.28 TFLOPSFP16 | ·· 844.8 GFLOPSFP16 |
NPU Model NPU 5 | NPU Model Hexagon 692 |
NPU Cores 3 | NPU Cores - |
Performance 47 TOPSINT8 | Performance 5 TOPS |
Modem Model - | Modem Model X15 |
Peak Down - | Peak Down Up to 800Mbps |
Peak Up - | Peak Up Up to 150Mbps |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Kryo 468ARMv8.2-A |
Family | Family |
Branding  | Branding  |
Codename Panther Lake-U Panther Lake-U-4P-4EVariant Cougar CoveP-Core DarkmontM-Core DarkmontE-Core | Codename - - Cortex-A76P-Core - Cortex-A55E-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 5, 2026 | Release Date May 19, 2021 |
Foundry Intel | Foundry Samsung |
Other Foundries InteliGPU TSMCPCH | Other Foundries - |
Fabrication Node Intel 18A Intel 3iGPU N6PCH | Fabrication Node 8LPP - - |
Die Size 93mm² 27mm²iGPU 49mm²PCH | Die Size - |
Transistor Count 4 MillionPCH | Transistor Count - |
No images available
No images available
Laptops - | Laptops |