Intel Core Ultra 7 265HX vs Intel Core Ultra 7 255H Full Specs
20 Cores(8P+12E) 20 Threads(8P+12E) 2.6GHz | 16 Cores(6P+8M+2E) 16 Threads(6P+8M+2E) 2GHz |
TDP 55W | TDP 28W |
Bandwidth 102.4GB/s DDR5 | Bandwidth 134.4GB/s · |
iGPU | iGPU |
·· 3.89 TFLOPSFP16 | ·· 9.22 TFLOPSFP16 |
Socket | Socket |
Core Ultra 7 265HX-Core Ultra 7 255H2,79920 Cores 8P - 12E | 16 Cores 6P 8M 2E |
20 Threads 8P - 12E | 16 Threads 6P 8M 2E |
Base Clock 2.6GHz | Base Clock 2GHz |
Boost Clock 5.3GHz | Boost Clock 5.1GHz |
Overclocking Unlocked | Overclocking Locked |
L1i 64KB P - 64KB E | L1i 64KB P 64KB M 64KB E |
L1d 48KB P - 32KB E | L1d 48KB P 32KB M 32KB E |
L2 3MB P - 12MB E shared | L2 3MB P 8MB M shared 2MB E shared |
L3 12MB | L3 18MB |
Type DDR5 | Type · |
Max Memory 192GB | Max Memory 128GB |
ECC Yes | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 6400MT/s | Speed 8400MT/s |
Bandwidth 102.4GB/s | Bandwidth 134.4GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 102.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 134.4GB/s |
TDP 55W | TDP 28W |
cTDP-down 45W | cTDP-down 20W |
Peak Power 160W | Peak Power 115W |
Max Operating Temp 105°C Max | Max Operating Temp 110°C Max |
Bus Type DMI | Bus Type - |
Bus Config 8 lanes | Bus Config - |
Bus Speed 16GT/s | Bus Speed - |
Bus Bandwidth 16GB/s | Bus Bandwidth - |
PCIe PCIe 5.0 x2078.8GB/sBandwidth | PCIe PCIe 5.0 x831.5GB/sBandwidth |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | PCIe Secondary PCIe 4.0 x2039.4GB/sBandwidth |
iGPU | iGPU |
Shaders 512 | Shaders 1024 |
Boost Clock 1.9GHz | Boost Clock 2.25GHz |
·· 3.89 TFLOPSFP16 | ·· 9.22 TFLOPSFP16 |
NPU Model AI Boost 3 | NPU Model AI Boost 3 |
NPU Cores 2 | NPU Cores 2 |
Performance 13 TOPSINT8 | Performance 13 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA x86-64 |
Architecture | Architecture |
Family | Family |
Branding  | Branding |
Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core - SkymontE-Core | Codename Arrow Lake-H Arrow Lake-H-6P-8EVariant Lion CoveP-Core SkymontM-Core CrestmontE-Core |
Market Segment Laptop | Market Segment Laptop |
Release Date Jan 6, 2025 | Release Date Jan 6, 2025 |
Foundry TSMC | Foundry TSMC |
Other Foundries TSMCiGPU TSMCIO TSMCSoC | Other Foundries TSMCiGPU TSMCIO TSMCSoC |
Fabrication Node N3B N5iGPU N6IO N6SoC | Fabrication Node N3B N5iGPU N6IO N6SoC |
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC | Die Size - 44mm²iGPU 28mm²IO 100mm²SoC |
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