Intel Core Ultra 7 265HX vs Qualcomm Snapdragon X2 Elite Extreme (X2E-96-100) Full Specs

Summary

20 Cores(8P+12E) 20 Threads(8P+12E) 2.6GHz	18 Cores(12P+6E) 18 Threads(12P+6E) 4.4GHz
TDP 55W	TDP 80W
Bandwidth 102.4GB/s DDR5	Bandwidth 228.6GB/s LPDDR5X
iGPU Graphics 4C 1900MHz	iGPU Adreno X2-90 7.6T
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 15.16 TFLOPSFP16
Socket BGA 2114	Socket -

Highlights

E-Core Boost

E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 7 265HX4.6GHz

x1

Snapdragon X2 Elite Extreme (X2E-96-100)-

-

Core Config

20 Cores 8P 12E	18 Cores 12P 6E
20 Threads 8P 12E	18 Threads 12P 6E

Clocks

Base Clock 2.6GHz	Base Clock 4.4GHz
Boost Clock 5.3GHz	Boost Clock 5GHz
Overclocking Unlocked	Overclocking Locked

Cache

L1i 64KB P 64KB E	L1i 192KB P 128KB E
L1d 48KB P 32KB E	L1d 96KB P 64KB E
L2 3MB P - 12MB E shared	L2 36MB P shared 12MB E shared
L3 12MB	L3 -

Memory

Type DDR5	Type LPDDR5X
Max Memory 192GB	Max Memory 192GB
ECC Yes	ECC No
Channels 2	Channels 12
Bus Width 128-bit	Bus Width 192-bit
Speed 6400MT/s	Speed 9523MT/s
Bandwidth 102.4GB/s	Bandwidth 228.6GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 228.6GB/s

Power & Thermals

TDP 55W	TDP 80W
cTDP-down 45W	cTDP-down -
Peak Power 160W	Peak Power -
Max Operating Temp 105°C Max	Max Operating Temp -

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x20 78.8GB/sBandwidth	PCIe PCIe 5.0 x12 47.3GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Graphics 4C 1900MHz	iGPU Adreno X2-90 7.6T
Shaders 512	Shaders 2048
Boost Clock 1.9GHz	Boost Clock 1.85GHz
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 15.16 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model Hexagon
NPU Cores 2	NPU Cores -
Performance 13 TOPSINT8	Performance 80 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Arrow Lake	Architecture Oryon 3ARMv8.7-A
Family Core Ultra Series 2	Family X Series
Branding	Branding
Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core	Codename Glymur - Pegasus-PP-Core Pegasus-EE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Sep 24, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node N3B N5iGPU N6IO N6SoC	Fabrication Node N3E - - -
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC	Die Size 288mm² - - -

Images

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Competitors

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