Intel Core Ultra 9 275HX vs Apple M4 (10C8G-FL) Full Specs
24 Cores(8P+16E) 24 Threads(8P+16E) 2.7GHz | 10 Cores(4P+6E) 10 Threads(4P+6E) 4.41GHz |
TDP 55W | TDP 15W |
Bandwidth 102.4GB/s DDR5 | Bandwidth 120GB/s LPDDR5X |
iGPU | iGPU |
·· 3.89 TFLOPSFP16 | ·· 3.23 TFLOPSFP16 |
Socket | Socket - |
Core Ultra 9 275HX3,044
M4 (10C8G-FL)3,76724 Cores 8P 16E | 10 Cores 4P 6E |
24 Threads 8P 16E | 10 Threads 4P 6E |
Base Clock 2.7GHz | Base Clock 4.41GHz |
Boost Clock 5.4GHz | Boost Clock - |
Overclocking Unlocked | Overclocking Locked |
L1i 64KB P 64KB E | L1i 192KB P 128KB E |
L1d 48KB P 32KB E | L1d 128KB P 64KB E |
L2 3MB P - 16MB E shared | L2 16MB P shared 4MB E shared |
L3 24MB | L3 - |
SLC Cache - | SLC Cache 8MB |
Type DDR5 | Type LPDDR5X |
Max Memory 192GB | Max Memory 24GB |
ECC No | ECC No |
Channels 2 | Channels 2 |
Bus Width 128-bit | Bus Width 128-bit |
Speed 6400MT/s | Speed 7500MT/s |
Bandwidth 102.4GB/s | Bandwidth 120GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 102.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 120GB/s |
TDP 55W | TDP 15W |
cTDP-down 45W | cTDP-down - |
Peak Power 160W | Peak Power - |
Max Operating Temp 105°C Max | Max Operating Temp 100°C Max |
Bus Type DMI | Bus Type - |
Bus Config 8 lanes | Bus Config - |
Bus Speed 16GT/s | Bus Speed - |
Bus Bandwidth 16GB/s | Bus Bandwidth - |
PCIe PCIe 5.0 x2078.8GB/sBandwidth | PCIe PCIe 4.0 x59.8GB/sBandwidth |
PCIe Secondary PCIe 4.0 x47.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 512 | Shaders 1024 |
Boost Clock 1.9GHz | Boost Clock 1.58GHz |
·· 3.89 TFLOPSFP16 | ·· 3.23 TFLOPSFP16 |
NPU Model AI Boost 3 | NPU Model H16 Leto |
NPU Cores 2 | NPU Cores 16 |
NPU Clock - | NPU Clock 2.36GHz |
Performance 13 TOPSINT8 | Performance 38 TOPSINT8 |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Apple Silicon 14ARMv9.2-A |
Family | Family |
Branding  | Branding  |
Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core SkymontE-Core | Codename Donan M4Variant AS14PP-Core AS14EE-Core |
Market Segment Laptop | Market Segment Tablet |
Release Date Jan 6, 2025 | Release Date Mar 5, 2025 |
Foundry TSMC | Foundry TSMC |
Other Foundries TSMCiGPU TSMCIO TSMCSoC | Other Foundries - |
Fabrication Node N3B N5iGPU N6IO N6SoC | Fabrication Node N3E - - - |
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC | Die Size 169mm² - - - |
Transistor Count - | Transistor Count 28 Billion |
Transistor Density - | Transistor Density 165 MTr/mm² |
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Laptops | Laptops |