Intel Core Ultra 9 275HX vs Apple M5 Max (18C32G) Full Specs

Summary

24 Cores(8P+16E) 24 Threads(8P+16E) 2.7GHz	18 Cores(6P+12M) 18 Threads(6P+12M) 4.61GHz
TDP 55W	TDP 140W
Bandwidth 102.4GB/s DDR5	Bandwidth 460.8GB/s LPDDR5X
iGPU Graphics 4C 1900MHz	iGPU 32-Core M5 Max
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 26.54 TFLOPSFP16
Socket BGA 2114	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 9 275HX3,044

x1

M5 Max (18C32G)4,340

x1.43

Show Top Score

Core Config

24 Cores 8P - 16E	18 Cores 6P 12M -
24 Threads 8P - 16E	18 Threads 6P 12M -

Clocks

Base Clock 2.7GHz	Base Clock 4.61GHz
Boost Clock 5.4GHz	Boost Clock -
Overclocking Unlocked	Overclocking Locked

Cache

L1i 64KB P - 64KB E	L1i 192KB P 192KB M -
L1d 48KB P - 32KB E	L1d 128KB P 128KB M -
L2 3MB P - - 16MB E shared	L2 1MB P 16MB P shared 16MB M shared -
L3 24MB	L3 -
SLC Cache -	SLC Cache 48MB

Memory

Type DDR5	Type LPDDR5X
Max Memory 192GB	Max Memory 96GB
ECC No	ECC No
Channels 2	Channels 3
Bus Width 128-bit	Bus Width 384-bit
Speed 6400MT/s	Speed 9600MT/s
Bandwidth 102.4GB/s	Bandwidth 460.8GB/s
Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 102.4GB/s	Bandwidth Calculator Channels Transfer Rate9600MT/s Calculated Bandwidth 460.8GB/s

Power & Thermals

TDP 55W	TDP 140W
cTDP-down 45W	cTDP-down -
Peak Power 160W	Peak Power -
Max Operating Temp 105°C Max	Max Operating Temp 100°C Max

Chipset Bus

Bus Type DMI	Bus Type -
Bus Config 8 lanes	Bus Config -
Bus Speed 16GT/s	Bus Speed -
Bus Bandwidth 16GB/s	Bus Bandwidth -

Expansion

PCIe PCIe 5.0 x20 78.8GB/sBandwidth	PCIe PCIe 4.0 x16 31.5GB/sBandwidth
PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth	-

iGPU

iGPU Graphics 4C 1900MHz	iGPU 32-Core M5 Max
Shaders 512	Shaders 4096
Boost Clock 1.9GHz	Boost Clock 1.62GHz
Peak·FP32·FP16 3.89 TFLOPSFP16	Peak·FP32·FP16 26.54 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model H17 Hyperion
NPU Cores 2	NPU Cores 16
NPU Clock -	NPU Clock 2.45GHz
Performance 13 TOPSINT8	Performance 38 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Arrow Lake	Architecture Apple Silicon 15ARMv9.2-A
Family Core Ultra Series 2	Family M Series
Branding	Branding
Codename Arrow Lake-S Arrow Lake-S-8P-16EVariant Lion CoveP-Core - SkymontE-Core	Codename Sotra-S M5 MaxVariant AS15PP-Core AS15MM-Core -
Market Segment Laptop	Market Segment Desktop
Release Date Jan 6, 2025	Release Date Mar 3, 2026

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node N3B N5iGPU N6IO N6SoC	Fabrication Node N3P - - -
Die Size 135mm² 23mm²iGPU 28mm²IO 100mm²SoC	Die Size -

Images

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Used In

Laptops Blade 18(Early 2025)

Laptops MacBook Pro 14(M5 Max, Early 2026)MacBook Pro 16(M5 Max, Early 2026)

Competitors

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