Intel Core Ultra 9 285H vs Qualcomm Snapdragon X2 Elite Extreme (X2E-96-100) Full Specs

Summary

16 Cores(6P+8M+2E) 16 Threads(6P+8M+2E) 2.9GHz	18 Cores(12P+6E) 18 Threads(12P+6E) 4.4GHz
TDP 45W	TDP 80W
Bandwidth 134.4GB/s LPDDR5X·DDR5	Bandwidth 228.6GB/s LPDDR5X
iGPU Arc 140T 2350MHz	iGPU Adreno X2-90 7.6T
Peak·FP32·FP16 9.63 TFLOPSFP16	Peak·FP32·FP16 15.16 TFLOPSFP16
Socket BGA 2049	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi E-Core Boost Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Core Ultra 9 285H3,003

x1

Snapdragon X2 Elite Extreme (X2E-96-100)-

-

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Core Config

16 Cores 6P 8M 2E	18 Cores 12P - 6E
16 Threads 6P 8M 2E	18 Threads 12P - 6E

Clocks

Base Clock 2.9GHz	Base Clock 4.4GHz
Boost Clock 5.4GHz	Boost Clock 5GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 64KB P 64KB M 64KB E	L1i 192KB P - 128KB E
L1d 48KB P 32KB M 32KB E	L1d 96KB P - 64KB E
L2 3MB P - 8MB M shared 2MB E shared	L2 36MB P shared - 12MB E shared
L3 12MB	L3 -

Memory

Type LPDDR5X·DDR5	Type LPDDR5X
Max Memory 128GB	Max Memory 192GB
ECC No	ECC No
Channels 2	Channels 12
Bus Width 128-bit	Bus Width 192-bit
Speed 8400MT/s	Speed 9523MT/s
Bandwidth 134.4GB/s	Bandwidth 228.6GB/s
Bandwidth Calculator Channels Transfer Rate8400MT/s Calculated Bandwidth 134.4GB/s	Bandwidth Calculator Channels Transfer Rate9523MT/s Calculated Bandwidth 228.6GB/s

Power & Thermals

TDP 45W	TDP 80W
cTDP-down 35W	cTDP-down -
Peak Power 115W	Peak Power -
Max Operating Temp 110°C Max	Max Operating Temp -

Expansion

PCIe PCIe 5.0 x8 31.5GB/sBandwidth	PCIe PCIe 5.0 x12 47.3GB/sBandwidth
PCIe Secondary PCIe 4.0 x20 39.4GB/sBandwidth	PCIe Secondary PCIe 4.0 x4 7.9GB/sBandwidth

iGPU

iGPU Arc 140T 2350MHz	iGPU Adreno X2-90 7.6T
Shaders 1024	Shaders 2048
Boost Clock 2.35GHz	Boost Clock 1.85GHz
Peak·FP32·FP16 9.63 TFLOPSFP16	Peak·FP32·FP16 15.16 TFLOPSFP16

NPU

NPU Model AI Boost 3	NPU Model Hexagon
NPU Cores 2	NPU Cores -
Performance 13 TOPSINT8	Performance 80 TOPSINT8

Chip

Manufacturer Intel	Manufacturer Qualcomm
ISA x86-64	ISA AArch64
Architecture Arrow Lake	Architecture Oryon 3ARMv8.7-A
Family Core Ultra Series 2	Family X Series
Branding	Branding
Codename Arrow Lake-H Arrow Lake-H-6P-8EVariant Lion CoveP-Core SkymontM-Core CrestmontE-Core	Codename Glymur - Pegasus-PP-Core - Pegasus-EE-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 6, 2025	Release Date Sep 24, 2025

Fabrication

Foundry TSMC	Foundry TSMC
Other Foundries TSMCiGPU TSMCIO TSMCSoC	Other Foundries -
Fabrication Node N3B N5iGPU N6IO N6SoC	Fabrication Node N3E - - -
Die Size - 44mm²iGPU 28mm²IO 100mm²SoC	Die Size 288mm² - - -

Images

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Competitors

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