Intel Mobile Pentium 4 HT 552 vs AMD Ryzen AI Max+ 395 Full Specs

Summary

1 Cores 2 Threads 3.46GHz	16 Cores 32 Threads 3GHz
TDP 88W	TDP 65W
Bandwidth -	Bandwidth 256GB/s LPDDR5X
iGPU 0	iGPU Radeon 8060S
Peak·FP32·FP16 -	Peak·FP32·FP16 29.7 TFLOPSFP16
Socket Socket 478	Socket FP11

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Mobile Pentium 4 HT 552130

x1

Ryzen AI Max+ 3952,984

x22.95

Show Top Score

Core Config

1 Cores	16 Cores
2 Threads	32 Threads

Clocks

Base Clock 3.46GHz	Base Clock 3GHz
Boost Clock -	Boost Clock 5.1GHz
Overclocking Locked	Overclocking Locked

Cache

L1i 16KB	L1i 32KB
L1d 16KB	L1d 48KB
L2 1MB	L2 1MB
L3 -	L3 64MB

Memory

Type -	Type LPDDR5X
Max Memory -	Max Memory 128GB
ECC -	ECC No
Channels -	Channels 4
Bus Width -	Bus Width 256-bit
Speed -	Speed 8000MT/s
Bandwidth -	Bandwidth 256GB/s
Bandwidth Calculator -	Bandwidth Calculator Channels Transfer Rate8000MT/s Calculated Bandwidth 256GB/s

Power & Thermals

TDP 88W	TDP 65W
cTDP-down -	cTDP-down 45W
cTDP-up -	cTDP-up 120W
Max Operating Temp -	Max Operating Temp 100°C Max
Voltage Range -	Voltage Range -
Included Cooler -	Included Cooler 0

Chipset Bus

Bus Type FSB	Bus Type PCIe
Bus Config 64-bit	Bus Config 4 lanes
Bus Speed 533MT/s	Bus Speed 16GT/s
Bus Bandwidth 4.3GB/s	Bus Bandwidth 8GB/s

Expansion

-	PCIe PCIe 4.0 x16 31.5GB/sBandwidth

iGPU

iGPU 0	iGPU Radeon 8060S
Shaders -	Shaders 2560
Boost Clock -	Boost Clock 2.9GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 29.7 TFLOPSFP16

NPU

NPU Model -	NPU Model XDNA 2
NPU Cores -	NPU Cores 32
Performance -	Performance 50 TOPSINT8

Chip

Manufacturer Intel	Manufacturer AMD
ISA x86-64	ISA x86-64
Architecture NetBurst	Architecture Zen 5
Family Pentium 4	Family Ryzen AI 300
Branding	Branding
Codename Prescott - -	Codename Strix Halo EldoraDie Zen 5P-Core
Market Segment Laptop	Market Segment Laptop
Release Date Jan 4, 2005	Release Date Jan 6, 2025

Fabrication

Foundry Intel	Foundry TSMC
Other Foundries -	Other Foundries TSMCSoC
Fabrication Node 90nm -	Fabrication Node N4X N5SoC
Die Size 112mm²	Die Size 141mm²
Transistor Count 125 Million	Transistor Count 16.6 Billion
Transistor Density 1 MTr/mm²	Transistor Density 118 MTr/mm²

Images

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Used In

Desktops -

Desktops Framework Desktop(Early 2025)

Competitors

IntelMobile Pentium 4 HT 552 vs CPU QualcommSnapdragon X2 Elite Extreme (X2E-96-100) IntelMobile Pentium 4 HT 552 vs CPU QualcommSnapdragon X2 Elite (X2E-80-100) IntelMobile Pentium 4 HT 552 vs CPU QualcommSnapdragon X2 Elite (X2E-88-100) Show 4 more

AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 390 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max PRO 380 AMDRyzen AI Max+ 395 vs CPU AMDRyzen AI Max 385 Show 12 more