Intel N200 vs Qualcomm Snapdragon 662 Full Specs
4 Cores 4 Threads 1GHz | 8 Cores(4P+4E) 8 Threads(4P+4E) 2GHz |
TDP 6W | TDP 5W |
Bandwidth 38.4GB/s ·· | Bandwidth 14.9GB/s LPDDR4X |
iGPU | iGPU |
·· 768 GFLOPSFP16 | ·· 486.4 GFLOPSFP16 |
Socket | Socket - |
N2001,306
Snapdragon 6623314 Cores 4P - | 8 Cores 4P 4E |
4 Threads 4P - | 8 Threads 4P 4E |
Base Clock 1GHz | Base Clock 2GHz |
Boost Clock 3.7GHz | Boost Clock - |
Overclocking Locked | Overclocking Locked |
L1i 64KB P - | L1i 32KB P 16KB E |
L1d 32KB P - | L1d 32KB P 16KB E |
L2 2MB P shared - | L2 2MB P shared 1MB E shared |
L3 6MB | L3 - |
Type ·· | Type LPDDR4X |
Max Memory 16GB | Max Memory 8GB |
ECC No | ECC No |
Channels 1 | Channels 2 |
Bus Width 64-bit | Bus Width 32-bit |
Speed 4800MT/s | Speed 3733MT/s |
Bandwidth 38.4GB/s | Bandwidth 14.9GB/s |
Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 38.4GB/s | Bandwidth Calculator Channels Transfer Rate Calculated Bandwidth 14.9GB/s |
TDP 6W | TDP 5W |
Max Operating Temp 105°C Max | Max Operating Temp - |
PCIe PCIe 3.0 x98.9GB/sBandwidth | - |
iGPU | iGPU |
Shaders 256 | Shaders 128 |
Boost Clock 750MHz | Boost Clock 950MHz |
·· 768 GFLOPSFP16 | ·· 486.4 GFLOPSFP16 |
NPU Model GNA 3.0 | NPU Model Hexagon 683 |
Modem Model - | Modem Model X11 |
Peak Down - | Peak Down Up to 390Mbps |
Peak Up - | Peak Up Up to 150Mbps |
Manufacturer | Manufacturer |
ISA x86-64 | ISA AArch64 |
Architecture | Architecture Kryo 260ARMv8.0-A |
Family | Family |
Branding  | Branding  |
Codename Alder Lake-N Alder Lake-8EVariant GracemontP-Core - | Codename - - Cortex-A73P-Core Cortex-A53E-Core |
Market Segment Laptop | Market Segment Smartphone |
Release Date Jan 3, 2023 | Release Date Jan 20, 2020 |
Foundry Intel | Foundry Samsung |
Fabrication Node Intel 7 | Fabrication Node 14LPP |
Die Size 122mm² | Die Size - |
Transistor Count 8.5 Billion | Transistor Count - |
Transistor Density 70 MTr/mm² | Transistor Density - |
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