Intel Xeon W3670 vs Apple M3 Ultra (28C60G) Full Specs

Summary

6 Cores 12 Threads 3.2GHz	28 Cores(20P+8E) 28 Threads(20P+8E) 4.05GHz
TDP 130W	TDP 300W
Bandwidth 25.6GB/s DDR3	Bandwidth 819.2GB/s LPDDR5
iGPU 0	iGPU 60-Core M3 Ultra
Peak·FP32·FP16 -	Peak·FP32·FP16 21.2 TFLOPSFP16
Socket LGA 1366	Socket -

Highlights

Geekbench 6 Single

Geekbench 6 Single Geekbench 6 Multi Max Bandwidth iGPU Peak iGPU FP32 iGPU FP16 NPU TOPS TDP

Xeon W3670533

x1

M3 Ultra (28C60G)3,221

x6.04

Show Top Score

Core Config

6 Cores 6P -	28 Cores 20P 8E
12 Threads 12P -	28 Threads 20P 8E

Clocks

Base Clock 3.2GHz	Base Clock 4.05GHz
Boost Clock 3.4GHz	Boost Clock -
Overclocking Locked	Overclocking Locked

Cache

L1i 32KB P -	L1i 192KB P 128KB E
L1d 32KB P -	L1d 128KB P 64KB E
L2 256KB P - -	L2 64MB P shared 4MB E shared
L3 12MB	L3 -
SLC Cache -	SLC Cache 96MB

Memory

Type DDR3	Type LPDDR5
Max Memory 24GB	Max Memory 128GB
ECC Yes	ECC No
Channels 3	Channels 8
Bus Width 192-bit	Bus Width 1024-bit
Speed 1066MT/s	Speed 6400MT/s
Bandwidth 25.6GB/s	Bandwidth 819.2GB/s
Bandwidth Calculator Channels Transfer Rate1066MT/s Calculated Bandwidth 25.6GB/s	Bandwidth Calculator Channels Transfer Rate6400MT/s Calculated Bandwidth 819.2GB/s

Power & Thermals

TDP 130W	TDP 300W
Max Operating Temp -	Max Operating Temp 100°C Max
T-Case 67.9°C Max	T-Case -
Voltage Range -	Voltage Range -

Chipset Bus

Bus Type QPI	Bus Type -
Bus Config 16-bit	Bus Config -
Bus Speed 4.8GT/s	Bus Speed -
Bus Bandwidth 9.6GB/s	Bus Bandwidth -

Expansion

-	PCIe PCIe 4.0 x32 63GB/sBandwidth

iGPU

iGPU 0	iGPU 60-Core M3 Ultra
Shaders -	Shaders 7680
Boost Clock -	Boost Clock 1.38GHz
Peak·FP32·FP16 -	Peak·FP32·FP16 21.2 TFLOPSFP16

NPU

NPU Model -	NPU Model H15 Erebus
NPU Cores -	NPU Cores 32
NPU Clock -	NPU Clock 2.36GHz
Performance -	Performance 36 TOPSFP16

Chip

Manufacturer Intel	Manufacturer Apple
ISA x86-64	ISA AArch64
Architecture Westmere	Architecture Apple Silicon 13ARMv8.6-A
Family Xeon	Family M Series
Branding	Branding
Codename Gulftown - - -	Codename Palma-D M3 UltraVariant EverestP-Core Sawtooth E-Core
Market Segment Workstation	Market Segment Workstation
Release Date Aug 29, 2010	Release Date Mar 5, 2025

Fabrication

Foundry Intel	Foundry TSMC
Fabrication Node 32nm	Fabrication Node N3B
Die Size 240mm²	Die Size 954mm²
Transistor Count 1.2 Billion	Transistor Count 184 Billion
Transistor Density 5 MTr/mm²	Transistor Density 193 MTr/mm²

Images

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Used In

Desktops -

Desktops Mac Studio(M3 Ultra, Early 2025)

Competitors

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