CPUs

MediaTek Dimensity 1300 vs MediaTek Dimensity 8300 Full Specs

8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3GHz
8 Cores(1P+3M+4E)
8 Threads(1P+3M+4E)
3.35GHz
Bandwidth
34.1GB/s
LPDDR4X
Bandwidth
68.3GB/s
LPDDR5X
iGPU
iGPU
··
1.02 TFLOPSFP16
··
2.15 TFLOPSFP16

Dimensity 1300Dimensity 130034.1GB/s
x1
Dimensity 8300Dimensity 830068.3GB/s
x2.00

8 Cores
1P
3M
4E
8 Cores
1P
3M
4E
8 Threads
1P
3M
4E
8 Threads
1P
3M
4E

Base Clock
3GHz
Base Clock
3.35GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
64KB M
32KB E
L1i
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L1d
64KB P
64KB M
32KB E
L2
512KB P
512KB M
128KB E
L2
1MB P
512KB M
128KB E

Type
LPDDR4X
Type
LPDDR5X
ECC
No
ECC
No
Channels
4
Channels
4
Bus Width
64-bit
Bus Width
64-bit
Speed
4266MT/s
Speed
8533MT/s
Bandwidth
34.1GB/s
Bandwidth
68.3GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
34.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
Calculated Bandwidth
68.3GB/s

iGPU
iGPU
Shaders
288
Shaders
384
Boost Clock
886MHz
Boost Clock
1.4GHz
··
1.02 TFLOPSFP16
··
2.15 TFLOPSFP16

NPU Model
APU 3.0
NPU Model
MediaTek APU 780
NPU Cores
6
NPU Cores
-
Performance
4.5 TOPS
Performance
-

Modem Model
MT 5G
Modem Model
MT 5G R2
Cellular
5G
Cellular
5G
Peak Down
Up to 2.8Gbps
Peak Down
Up to 4.7Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
Family
Family
Branding
Dimensity  branding
Branding
Dimensity 8300  branding
Codename
Cortex-A78P-Core
Cortex-A78M-Core
Cortex-A55E-Core
Codename
Cortex-A715P-Core
Cortex-A715M-Core
Cortex-A510E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
May 1, 2022
Release Date
Nov 21, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N4P

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