MediaTek Dimensity 6300

Dimensity 6300

Qualcomm Snapdragon 4 Gen 2

Snapdragon 4 Gen 2

MediaTek Dimensity 6300 vs Qualcomm Snapdragon 4 Gen 2 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2.4GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2.2GHz
TDP
-
TDP
5W
Bandwidth
17.1GB/s
LPDDR4X
Bandwidth
25.6GB/s
·
iGPU
iGPU
··
281.6 GFLOPSFP16
··
489 GFLOPSFP16

Dimensity 6300Dimensity 6300
x1
Snapdragon 4 Gen 2Snapdragon 4 Gen 2
x1.28

8 Cores
2P
6E
8 Cores
2P
6E
8 Threads
2P
6E
8 Threads
2P
6E

Base Clock
2.4GHz
Base Clock
2.2GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
64KB P
32KB E
L1d
64KB P
32KB E
L1d
64KB P
32KB E
L2
512KB P
128KB E
L2
512KB P
128KB E
L3
2MB
L3
-

Type
LPDDR4X
Type
·
Max Memory
-
Max Memory
8GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
32-bit
Speed
4266MT/s
Speed
6400MT/s
Bandwidth
17.1GB/s
Bandwidth
25.6GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
25.6GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
64
Shaders
128
Boost Clock
1.1GHz
Boost Clock
955MHz
··
281.6 GFLOPSFP16
··
489 GFLOPSFP16

NPU Model
APU 3.0
NPU Model
-
NPU Cores
3
NPU Cores
-
Performance
2.4 TOPS
Performance
-

Modem Model
MT 5G
Modem Model
X61
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 2.8Gbps
Peak Down
Up to 2.5Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 900Mbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv8.2-A
Family
Family
Branding
Dimensity  branding
Branding
Snapdragon 4 Gen 2  branding
Codename
Cortex-A76P-Core
Cortex-A55E-Core
Codename
Cortex-A78P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Apr 1, 2024
Release Date
Jun 1, 2023

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N6