CPUs

MediaTek Dimensity 6300 vs Qualcomm Snapdragon 6s Gen 3 Full Specs

8 Cores(2P+6E)
8 Threads(2P+6E)
2.4GHz
8 Cores(2P+6E)
8 Threads(2P+6E)
2.3GHz
TDP
-
TDP
5W
Bandwidth
17.1GB/s
LPDDR4X
Bandwidth
17.1GB/s
LPDDR4X
iGPU
iGPU
··
281.6 GFLOPSFP16
··
972.8 GFLOPSFP16

8 Cores
2P
6E
8 Cores
2P
6E
8 Threads
2P
6E
8 Threads
2P
6E

Base Clock
2.4GHz
Base Clock
2.3GHz
Overclocking
Locked
Overclocking
Locked

L1i
64KB P
32KB E
L1i
64KB P
32KB E
L1d
64KB P
32KB E
L1d
64KB P
32KB E
L2
512KB P
128KB E
L2
512KB P
128KB E
L3
2MB
L3
-

Type
LPDDR4X
Type
LPDDR4X
Max Memory
-
Max Memory
12GB
ECC
No
ECC
No
Channels
2
Channels
2
Bus Width
32-bit
Bus Width
32-bit
Speed
4266MT/s
Speed
4266MT/s
Bandwidth
17.1GB/s
Bandwidth
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
17.1GB/s
Bandwidth Calculator
Channels
Transfer Rate
··
17.1GB/s

TDP
-
TDP
5W

iGPU
iGPU
Shaders
64
Shaders
256
Boost Clock
1.1GHz
Boost Clock
950MHz
··
281.6 GFLOPSFP16
··
972.8 GFLOPSFP16

NPU Model
APU 3.0
NPU Model
Hexagon
NPU Cores
3
NPU Cores
-
Performance
2.4 TOPS
Performance
-

Modem Model
MT 5G
Modem Model
X62
Cellular
5G
Cellular
5G mmWave
Peak Down
Up to 2.8Gbps
Peak Down
Up to 4.4Gbps
Peak Up
Up to 900Mbps
Peak Up
Up to 1.6Gbps

Manufacturer
Manufacturer
ISA
AArch64
ISA
AArch64
Architecture
Architecture
KryoARMv8.2-A
Family
Family
Branding
Dimensity  branding
Branding
Snapdragon 6s Gen 3  branding
Codename
Cortex-A76P-Core
Cortex-A55E-Core
Codename
Cortex-A78P-Core
Cortex-A55E-Core
Market Segment
Smartphone
Market Segment
Smartphone
Release Date
Apr 1, 2024
Release Date
Jun 1, 2024

Foundry
TSMC
Foundry
TSMC
Fabrication Node
N7
Fabrication Node
N6